Heat Dissipation Plate Arch Structure for LCD Thermal Management
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Solution Overview
Problem
Existing side type back light modules in LCDs face heat dissipation challenges, where the combined heat from LEDs and PCBs leads to increased heat dissipation pressure on the PCB, accelerating its aging and reducing the display device's lifetime due to inadequate heat management in compact structures.
Innovation Solution
The implementation of an arch structure on the heat dissipation plate in the backlight module, which reduces the heat conducted to the back plate corresponding to the circuit board, thereby lowering the circuit board's temperature and preventing aging, while enhancing heat dissipation through partial heat conduction to the inner space of the back plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a same heat dissipation plate is used to conduct heat from both the light source and the PCB, then the structure remains compact and simple, but the heat dissipation pressure on the PCB increases excessively causing accelerated aging
Solution Approach 1:
The heat dissipation plate is divided into two independent parts: a first heat dissipation plate for the light source and a second heat dissipation plate for the PCB. This segmentation allows each component to have its own dedicated heat dissipation path, preventing heat overload on the PCB while maintaining structural simplicity.
Solution Approach 2:
The PCB heat dissipation function is extracted from the light source heat dissipation plate. By separating the PCB's heat dissipation requirement into an independent second heat dissipation plate, the system removes the harmful effect of excessive heat accumulation on the PCB, thereby extending its lifetime.
2Volume of moving object
If the light source and PCB are arranged in a heat dissipation chamber, then the structure is compact, but heat accumulation occurs causing increased temperature and accelerated component aging
Solution Approach 1:
The heat dissipation chamber is segmented into two independent heat dissipation paths: one for the light source and another for the PCB. Each path has its own heat dissipation plate, allowing heat to be distributed and dissipated separately rather than accumulating in a single chamber, thus controlling temperature while maintaining compact structure.
Solution Approach 2:
The first and second heat dissipation plates act as intermediaries between the heat sources (light source and PCB) and the surrounding environment. These intermediate structures provide dedicated thermal conduction paths that prevent direct heat accumulation on the PCB, effectively controlling temperature in the compact display device.
3Loss of energy
If heat dissipation holes are provided on the shell, then heat dissipation capability is improved, but the structure becomes more complex and the display device thickness increases
Solution Approach 1:
The heat dissipation function is extracted from the shell structure and transferred to dedicated heat dissipation plates. By providing heat dissipation holes specifically in these plates rather than in the shell, the system achieves effective heat dissipation without complicating the overall shell structure or increasing display device thickness.
Solution Approach 2:
The heat dissipation plates serve as intermediary structures that bridge the heat sources and the shell. By concentrating heat dissipation holes in these intermediate plates, the system achieves efficient heat dissipation while keeping the shell structure simple and maintaining compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a better heat dissipating effect, reduces heat dissipation pressure on the circuit board region, and prolongs the lifetime of the display device by distributing heat effectively and minimizing contact between the heat dissipation plate and the circuit board.
Implementation Method 1
the heat generated by the light source and the heat generated by the PCB are collected simultaneously and conducted through a same heat dissipation plate
Data Source
AI summary
A backlight module and a display panel. The backlight module comprises a light guide plate, a heat dissipation plate and a light source. The display panel comprises a liquid crystal screen and a circuit board connected with the liquid crystal screen, the liquid crystal screen and the circuit board are arranged parallel to an arrangement direction of the heat dissipation plate main body and are respectively arranged at two sides of the heat dissipation plate. By means of the display device, the heat conducted to the back plate in the region of the heat dissipating plate corresponding to the circuit board can be reduced, and the temperature of the region where the circuit board locates can be reduced, thereby preventing aging of the electronic component and prolonging the lifetime of the circuit board.