Heat Dissipation Plate Cutout for Compact Semiconductor Module
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Solution Overview
Problem
The existing semiconductor devices for electric vehicles face a challenge in minimizing the size increase of the insulating member when attached to a cooler, leading to increased device and module size due to the need for a creepage distance between the heat dissipation plate and the cooler.
Innovation Solution
A semiconductor device design featuring a heat dissipation plate with a cutout and a retracted portion, allowing the terminals to overlap the cutout area, which reduces the horizontal distance required for the creepage distance, thereby minimizing the size increase of the insulating plate and the semiconductor module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor device is attached to a cooler with an insulating plate interposed therebetween to ensure creepage distance, then electrical insulation is improved, but the size of the insulating plate increases
Solution Approach 1:
The heat dissipation plate is segmented by providing a cutout at its outer periphery, creating a recessed region. This segmentation allows the first terminal to be positioned in the cutout area, enabling the insulating plate to contact only the non-retracted portions of the heat dissipation plate, thereby reducing the required area of the insulating plate while maintaining adequate creepage distance for electrical insulation.
Solution Approach 2:
The invention utilizes the vertical dimension by forming a retracted portion at the outer periphery of the heat dissipation plate, creating a stepped structure. This dimensional change allows the first terminal to overlap the cutout area vertically, enabling the insulating plate to make contact at a different vertical level, thus reducing the horizontal footprint of the insulating plate while preserving electrical insulation.
2Reliability
If the creepage distance between the heat dissipation plate and the cooler is increased, then electrical insulation is improved, but the horizontal distance and device size increase
Solution Approach 1:
By segmenting the heat dissipation plate through the cutout, the invention creates distinct contact regions for the insulating plate. This segmentation allows the creepage distance to be effectively utilized in the vertical direction through the retracted portion, rather than requiring increased horizontal distance, thus maintaining electrical insulation without increasing device footprint.
Solution Approach 2:
The invention transitions the creepage distance requirement from the horizontal plane to the vertical dimension by forming the retracted portion at the outer periphery. This allows the insulating plate to contact the heat dissipation plate at a vertically elevated position, satisfying electrical insulation requirements through vertical separation rather than horizontal distance, thereby reducing overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the size increase of the insulating plate and semiconductor module, improving the device's compactness and productivity while maintaining reliable thermal management and electrical connectivity.
Implementation Method 1
a heat dissipation plate formed in a plate shape; a plurality of switching elements joined to one surface of the heat dissipation plate
Implementation Method 2
a sealing member sealing the plurality of switching elements, the heat dissipation plate, and the first terminal
Data Source
AI summary
This semiconductor device includes: a plate-shaped heat dissipation plate; a plurality of switching elements joined to one surface of the heat dissipation plate; a first terminal located apart from the heat dissipation plate, extending in a direction away from the heat dissipation plate, and connected via first conductors to surfaces of the switching elements on a side opposite to the heat dissipation plate side; and a sealing member sealing the switching elements, the heat dissipation plate, and the first terminal. A cutout is provided at an outer periphery of the heat dissipation plate. A part of the first terminal on the heat dissipation plate side overlaps a cut-out area at the cutout as seen in a direction perpendicular to the one surface of the heat dissipation plate. A retracted portion retracted inward is formed at an outer periphery of another surface of the heat dissipation plate.