Heat Dissipation Plate for Electronic Device Rigidity and Thermal Management
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Solution Overview
Problem
Electronic devices face challenges in efficiently dissipating heat while maintaining rigidity and slimming design, as existing heat dissipation structures are inadequate for modern, compact devices.
Innovation Solution
Incorporating a heat dissipation plate made of metallic material that overlaps with both the battery pack and substrate, using a fastening structure for electric isolation from the metallic housing to effectively transfer and dissipate heat, while also reinforcing the device's rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metallic member is used for the housing to reinforce rigidity and improve design quality, then the rigidity and aesthetic appearance are improved, but heat dissipation becomes more difficult due to metal's poor thermal radiation properties
Solution Approach 1:
The patent combines the housing structure with a heat dissipation plate, where the heat dissipation plate is integrated into the housing to serve dual functions: maintaining structural rigidity and enabling efficient heat dissipation. This merging resolves the contradiction by allowing the metal housing to provide mechanical strength while the integrated heat dissipation plate handles thermal management.
Solution Approach 2:
The patent employs a composite structure consisting of a metallic housing member and a heat dissipation plate made of heat-conductive material. This composite approach allows the system to benefit from both the mechanical properties of metal and the thermal properties of heat-conductive materials, simultaneously achieving rigidity and effective heat dissipation.
2Length of stationary object
If the electronic device is slimmed down to meet consumer preferences, then the device thickness is reduced, but heat dissipation efficiency deteriorates due to reduced space for heat dissipation structures
Solution Approach 1:
The patent utilizes the thickness dimension of the housing to accommodate the heat dissipation plate, allowing heat dissipation functionality to be integrated within the limited vertical space of a slim device. By stacking the heat dissipation plate within the housing thickness rather than adding external protrusions, the device maintains its slim profile while incorporating effective heat dissipation capability.
3Strength
If a separate plate type bracket is added to reinforce rigidity, then the structural strength is improved, but the device complexity and number of components increase
Solution Approach 1:
The patent merges the housing structure with the heat dissipation plate into a single integrated component. This eliminates the need for separate brackets or additional structural elements, as the heat dissipation plate itself serves as the structural reinforcement element, thereby reducing overall device complexity while maintaining rigidity.
Solution Approach 2:
The heat dissipation plate is designed to perform multiple functions simultaneously: it provides structural support to reinforce device rigidity, serves as a thermal management component for heat dissipation, and acts as a mounting surface for internal components. This multi-functionality reduces the need for separate specialized components, simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation, contributes to the slimming and rigidity reinforcement of electronic devices, and prevents electric shock by ensuring electrical isolation between components.
Implementation Method 1
Heat generated from the heat generating source may be dissipated to the battery pack and a peripheral structure through the heat dissipation plate
Data Source
Figure 1
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Figure 2B
AI summary
Provided is an electronic device that includes: a housing that includes a metallic member; a battery pack that is disposed in the housing; a substrate that is disposed in parallel with the battery pack and includes at least one heat generating source; a heat dissipation plate that is disposed to overlap with at least a portion of the battery pack and the substrate, and is formed of a metallic material. Heat generated from the heat generating source may be dissipated to the battery pack through the heat dissipation plate. The electronic device includes an efficient heat dissipation structure that also contributes to the rigidity reinforcement and slimming of the electronic device, and can prevent an electric shock accident beforehand, which may be caused by an exterior of a metallic member. Other various embodiments may be made.