Heat Dissipation Structure for Pluggable Heat Sources
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Solution Overview
Problem
The gap around pluggable electronic elements in electronic devices creates a high thermal resistance air layer, leading to poor heat dissipation effects when these elements are plugged in, necessitating an improvement in thermal management.
Innovation Solution
A heat dissipation structure comprising a housing with an accommodating groove, a supporting surface, and an inclined surface, where a heat conduction sheet is placed within the groove and covered by a thin film, allowing for direct heat dissipation and easy insertion of pluggable heat sources while minimizing the risk of thin film contact and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a gap is reserved around pluggable electronic elements to ensure smooth insertion and removal, then ease of operation is improved, but thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
A heat conduction sheet is introduced as an intermediary substance between the pluggable electronic element and the housing. This sheet fills the gap that was previously filled with air, providing both thermal conduction pathways and a low-friction surface for smooth insertion and removal operations
Solution Approach 2:
The thermal conductivity parameter of the gap region is changed by replacing air (high thermal resistance) with a heat conduction sheet (low thermal resistance). Simultaneously, the friction parameter is optimized by selecting materials with appropriate coefficients of friction for smooth operation
2Ease of operation
If a thin film is used to assist pluggable heat source insertion, then ease of operation is improved, but the risk of thin film contact and potential damage increases
Solution Approach 1:
A thin film with specific friction characteristics is applied to the housing surface to reduce friction during insertion and removal operations. The film is strategically positioned and dimensioned to provide operational assistance while minimizing exposure to potential damage from pluggable element contact
Solution Approach 2:
The thin film extends along the inclined surface in addition to covering the supporting surface, creating a multi-dimensional protective and friction-reducing surface. This extended coverage guides the pluggable element through the insertion path while maintaining film integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by guiding and stabilizing the pluggable heat source, reducing thermal resistance and improving structural stability during the plugging/unplugging process.
Implementation Method 1
The pluggable heat source can directly dissipate heat through the heat conduction sheet after it is placed into the housing
Implementation Method 2
the thin film that extends and covers the inclined surface can further prevent the pluggable heat source from contacting an end portion of the thin film during a plugging/unplugging process
Data Source
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AI summary
A heat dissipation structure includes a housing, a heat conduction sheet and a thin film. The housing includes a wall surface, which includes an accommodating groove, a supporting surface and an inclined surface. The accommodating groove is recessed on the supporting surface. The inclined surface is connected to the supporting surface, and is located on one side of the accommodating groove. The heat conduction sheet is accommodated in the accommodating groove, and a surface of the heat conduction sheet is in aligned with a surface of the supporting surface. The thin film covers the supporting surface, the heat conduction sheet and the inclined surface. An electronic device including the above housing and heat conduction sheet is further provided.