Heat-Dissipation Resin Composition for Electronic Temperature Control
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Solution Overview
Problem
Conventional heat dissipation sheets are insufficient in suppressing temperature elevation in electronic devices due to heat generated by electronic parts.
Innovation Solution
A resin composition comprising a polymer with high enthalpy of fusion and thermal conductivity, combined with a thermally conductive material, where the polymer is crosslinked and includes specific constitutional units for enhanced heat storage and dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation sheets are used, then heat dissipation is provided, but temperature elevation suppression is insufficient
Solution Approach 1:
The patent changes the thermal parameters of the heat dissipation sheet by incorporating a thermally conductive material with thermal conductivity of 1 W/(m·K) or higher (such as graphite, aluminum oxide, or boron nitride) and controlling its content to be 5-80 parts by weight per 100 parts by weight of polymer. This parameter optimization resolves the contradiction by achieving both adequate heat dissipation and superior temperature elevation suppression.
Solution Approach 2:
The patent creates a composite material system combining polymer components with thermally conductive materials. The composite structure allows the polymer matrix to provide structural integrity while the thermally conductive material particles dispersed within it create heat conduction pathways, simultaneously achieving heat dissipation and temperature control functions that neither material could achieve alone.
2Temperature
If thermally conductive material content is increased to improve heat dissipation, then thermal conductivity improves, but material cost and processing difficulty increase
Solution Approach 1:
The patent optimizes the content parameter of thermally conductive material to a specific range (5-80 parts by weight per 100 parts by weight of polymer). This parameter optimization ensures sufficient thermal conductivity improvement while avoiding excessive material content that would cause processing difficulties, manufacturing cost increases, or degradation of other material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively suppresses temperature elevation in electronic devices by utilizing a thermally conductive material with high thermal conductivity and a polymer with high enthalpy of fusion, providing improved heat dissipation and storage capabilities.
Implementation Method 1
a polymer (1) whose enthalpy of fusion observed within a temperature range of 10°C or higher and lower than 60°C in differential scanning calorimetry is 30 J/g or more
Implementation Method 2
a thermally conductive material (3) whose thermal conductivity is 1 W/(m·K) or higher
Data Source
Figure 1
AI summary
Provided is a resin composition from which a heat dissipation sheet having high effect to suppress temperature elevation due to heat generated by electronic parts (elements) can be obtained. Specifically provided is a resin composition comprising: a polymer (1) whose enthalpy of fusion observed within a temperature range of 10°C or higher and lower than 60°C in differential scanning calorimetry is 30 J/g or more; and a thermally conductive material (3) whose thermal conductivity is 1 W/(m·K) or higher, wherein the content of the thermally conductive material (3) is 1 part by weight or more and 80 parts by weight or less, with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition.