Heat Dissipation Structure With Sandwiched Storage Portion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation structures experience performance deterioration due to the embedding of heat storage bodies with lower thermal conductivity, which compromises the overall heat dissipation efficiency.
Innovation Solution
A heat dissipation structure incorporating a heat dissipation portion with a contact surface for electronic components, a heat storage portion that sandwiches the component, and a heat conductive member to efficiently transfer heat, along with a housing that accommodates the storage portion, allowing for effective heat storage and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a heat storage body is embedded in the body of the cooling body, then miniaturization of the cooling body is realized, but the thermal conductivity of the cooling body is deteriorated
Solution Approach 1:
The invention divides the heat dissipation system into three independent components: a heat dissipation portion (heat sink), a heat storage portion (phase change material container), and a heat conductive member. This segmentation allows each component to perform its specific function optimally without compromising the thermal conductivity of the heat dissipation portion, while still achieving miniaturization through the integrated but separate arrangement of these components.
Solution Approach 2:
The invention introduces a heat conductive member as an intermediary component that connects the electronic component to both the heat dissipation portion and the heat storage portion. This intermediary ensures efficient heat transfer from the electronic component to both the heat sink and the phase change material, resolving the contradiction by providing a dedicated heat conduction path that does not rely on embedding the heat storage body directly in the heat dissipation portion.
2Quantity of substance
If a heat storage body with lower thermal conductivity is embedded in the cooling body, then heat storage function is added, but the heat dissipation performance is deteriorated
Solution Approach 1:
The invention separates the heat storage function into an independent heat storage portion containing phase change material, distinct from the heat dissipation portion. This segmentation allows the system to gain heat storage capacity without compromising the heat dissipation efficiency of the heat sink, as both functions operate through separate but connected pathways via the heat conductive member.
Solution Approach 2:
The invention utilizes phase change material in the heat storage portion that absorbs and releases heat through phase transitions (melting and solidification). This phase change mechanism provides effective heat storage capacity without relying on thermal conduction through the heat storage material, thereby maintaining high heat dissipation efficiency while adding heat storage functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively suppresses temperature rises in electronic components by storing heat during high current conditions and dissipating it efficiently, preventing overheating and maintaining performance beyond failure temperatures.
Implementation Method 1
a heat dissipation portion that has a heat receiving surface including a contact surface in contact with an electronic component generating heat and dissipates the heat of the electronic component in contact with the contact surface
Implementation Method 2
dissipates the heat of the electronic component
Implementation Method 3
dissipates the heat of the electronic component
Implementation Method 4
a heat storage portion that is arranged to sandwich the electronic component, is provided to be in contact with the heat receiving surface, and stores the heat of the electronic component conducted through the heat dissipation portion
Implementation Method 5
stores the heat of the electronic component conducted through the heat dissipation portion
Implementation Method 6
a heat conductive member that is provided between the electronic component and the heat storage portion, and the heat receiving surface
Data Source
AI summary
A heat dissipation structure includes a heat dissipation portion and a heat storage portion. The heat dissipation portion has the heat receiving surface including the contact surface in contact with the semiconductor generating the heat, and dissipates the heat of the semiconductor in contact with the contact surface. The heat storage portion is arranged to sandwich the semiconductor. The heat storage portion has, for example, the heat storage opening portion in which the semiconductor is positioned, and surrounds the semiconductor. The heat storage portion is provided to he in contact with the heat receiving surface, and stores the heat of the semiconductor conducted through the heat dissipation portion.