Heat Dissipation Device with Segmented Airflow Channels

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Solution Overview

Problem

Existing heat dissipation devices for multiple CPUs suffer from inefficient heat dissipation due to waste heat interference between upwind and downwind CPUs, limited horizontal space constraining airflow, and high customization costs.

Innovation Solution

A heat dissipation device with a frame body featuring airflow channels separated by partition plates and flow guiding structures, allowing airflow to be directed vertically and preventing waste heat from affecting downwind CPUs, while utilizing existing ventilation devices to enhance airflow efficiency without customizing heat dissipation units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If multiple CPUs are arranged in series to improve computing speed, then computing capability is improved, but waste heat from upwind CPUs adversely affects downwind CPUs, reducing heat dissipation efficiency

Engineering Contradiction:
Improvecomputing capabilityVSAvoidheat dissipation efficiency
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The airflow channel is segmented into multiple independent channels using partition plates, with each CPU assigned to a separate channel. This segmentation prevents heat interference between CPUs while maintaining the series arrangement for improved computing capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The partition plates are arranged in different spatial dimensions (first partition plate in one dimension, second partition plate in another dimension), creating three-dimensional airflow separation. This multi-dimensional approach effectively isolates heat zones while preserving horizontal space for multiple CPUs.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If horizontal space is limited, then device compactness is improved, but airflow guidance becomes difficult, decreasing heat dissipation efficiency

Engineering Contradiction:
Improvehorizontal spaceVSAvoidheat dissipation efficiency
Core Design Contradiction:
Area of stationary objectVSTemperature

Solution Approach 1:

The invention utilizes vertical space by arranging partition plates in different dimensions, creating airflow separation without requiring additional horizontal space. This allows effective airflow guidance within limited horizontal footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple partition plates are nested within the same horizontal space, with the first and second partition plates positioned at different locations and orientations. This nested arrangement creates multiple airflow channels without expanding the horizontal footprint.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Temperature

If heat dissipation devices are customized to improve heat dissipation efficiency, then cooling performance is improved, but manufacturing cost increases significantly

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The heat dissipation device is segmented into standardized modular components (frame body, partition plates, flow guiding structures) that can be manufactured independently and assembled. This modularity enables mass production of standard parts, reducing customization costs.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The partition plates and flow guiding structures serve multiple functions: they separate airflow channels, guide wind flow, and prevent heat interference simultaneously. This multi-functionality reduces the number of specialized components needed, lowering manufacturing complexity and cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively isolates airflow channels to prevent waste heat interference, optimizes airflow utilization, and reduces costs by eliminating the need for specialized heat dissipation units, achieving improved cooling efficiency for high-power CPUs.

Implementation Method 1

a frame body having an airflow channel therein; a first partition plate disposed inside the frame body for separating one side of the airflow channel into a first channel and a second channel

Methodology Applied
Scientific EffectAirflow: Convection

Implementation Method 2

fans or other heat dissipation devices are usually mounted on the CPUs to dissipate heat

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Data Source

PatentUS11696419B2Heat dissipation device
Publication Date: 2023.07.04 AEWIN TECH CO LTD
  • US11696419B2 patent drawing
  • US11696419B2 patent drawing
  • US11696419B2 patent drawing

AI summary

A heat dissipation device is provided and includes a frame body having an airflow channel therein; a first partition plate and a second partition plate for separating the airflow channel into a first channel, a second channel, a third channel and a fourth channel; a first flow guiding structure for isolating the fourth channel from the second channel; and a second flow guiding structure for isolating the first channel from the third channel. The first partition plate, the first flow guiding structure, the second flow guiding structure and the second partition plate collectively form a first flow channel communicating the first channel and the fourth channel and a second flow channel communicating the second channel and the third channel, where the first flow channel and the second flow channel are separate from one another.