Heat Dissipation Unit With Segmented Heat Conduction Members
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Solution Overview
Problem
Conventional heat dissipation components, such as heat sinks, heat pipes, and vapor chambers, face challenges in effectively dissipating heat from components with varying heights on electronic circuit boards, leading to poor heat conduction efficiency and dissipation due to mismatched heights.
Innovation Solution
A manufacturing method for a heat dissipation unit involving a mold with a receiving depression and a capillary structure, where heat conduction members are positioned in sinks and thermally pressed with upper and lower plates to form a plate body, allowing for precise connection and efficient heat transfer across components of different heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation components (heat sink, heat pipe, vapor chamber) are used, then heat dissipation function is provided, but poor heat conduction efficiency occurs when heat generation component height is lower than peripheral components
Solution Approach 1:
The heat dissipation component is divided into a plate body and multiple heat conduction members with different heights. Each heat conduction member is independently positioned in sinks formed on the plate body, allowing each member to match the height of different heat generation components, thereby improving both heat conduction efficiency and adaptability to varying component heights.
Solution Approach 2:
Different regions of the heat dissipation component have different local properties through the use of heat conduction members with varying heights. Each heat conduction member is specifically designed to match the height of the underlying heat generation component, creating localized optimal heat conduction paths while maintaining overall system adaptability.
2Reliability
If multiple separate manufacturing steps are used for heat dissipation component assembly, then connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The manufacturing process merges multiple steps into a single thermal pressing operation. The plate body and multiple heat conduction members are simultaneously connected through one thermal pressing step, achieving reliable connections while simplifying the manufacturing process and reducing complexity compared to sequential assembly methods.
Solution Approach 2:
The sinks are pre-formed on the plate body before the thermal pressing step. This preliminary action allows the heat conduction members to be precisely positioned and automatically aligned during the single thermal pressing operation, ensuring connection reliability while maintaining manufacturing simplicity.
3Reliability
If conventional heat dissipation components are used, then basic heat dissipation function is achieved, but poor heat dissipation effect occurs due to height mismatch with heat generation components
Solution Approach 1:
The heat dissipation component is segmented into multiple heat conduction members of different heights, allowing each member to fully contact heat generation components of corresponding heights. This segmentation enables the system to adapt to various component configurations while maintaining optimal heat dissipation efficiency.
Solution Approach 2:
The height parameter of heat conduction members is varied to match different heat generation component heights. By changing this geometric parameter, the system achieves both improved heat dissipation efficiency through full contact and enhanced adaptability to different component configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces costs, and enhances heat dissipation efficiency by allowing for direct contact and alignment of heat conduction members with heat generation components, improving overall heat transfer and dissipation.
Implementation Method 1
the liquid working fluid is evaporated into vapor working fluid and the heat is conducted to the other face (condensation face) of the case. The vapor working fluid is cooled and condensed into liquid working fluid
Implementation Method 2
The liquid working fluid further flows back to the heated face due to gravity or capillary attraction of the capillary structure to continue the vapor-liquid circulation
Implementation Method 3
the at least one heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections
Data Source
AI summary
A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.