Heat Dissipation System With Segmented Thermal Pathways
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Solution Overview
Problem
Traditional heat dissipation modules in electronic products are high in energy consumption and large in size due to the direct placement and high energy requirements of thermoelectric coolers, which degrades performance and complicates the development of compact devices.
Innovation Solution
A heat dissipation system comprising a first heat dissipation module directly in contact with heat sources, a thermoelectric cooler indirectly in contact through the first module, and a second active heat dissipation module with a fan and heat sink to cool the thermoelectric cooler, allowing the thermoelectric cooler to be turned on/off based on a predetermined temperature threshold, reducing energy consumption and waste heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thermoelectric cooler is directly disposed on the CPU, then the CPU heat can be directly transferred to the TEC, but the TEC requires lots of energy and generates high waste heat, resulting in high energy consumption and reduced cooling efficiency
Solution Approach 1:
A heat conducting plate is introduced as an intermediary between the CPU and the thermoelectric cooler. The plate has a first surface in contact with the CPU and a second surface in contact with the TEC, allowing heat to be conducted from the CPU through the plate to the TEC. This intermediary structure distributes the thermal load and reduces the direct thermal stress on the TEC, enabling it to operate more efficiently with lower energy consumption while maintaining effective CPU cooling.
2Temperature
If the thermoelectric cooler is directly disposed on the CPU, then cooling can be achieved, but the waste heat from the TEC increases CPU temperature, requiring an additional large size heat dissipation module
Solution Approach 1:
The heat dissipation function for both the CPU and the thermoelectric cooler is merged into a single integrated heat dissipation module. The module includes a heat sink with a first heat dissipation surface contacting the CPU and a second heat dissipation surface contacting the TEC. The fan blows air to simultaneously dissipate heat from both surfaces, eliminating the need for separate heat dissipation modules and reducing overall device complexity and size.
3Productivity
If the thermoelectric cooler is operated in high power mode to cool the CPU, then cooling efficiency is improved, but the waste heat generated increases CPU temperature, decreasing cooling efficiency
Solution Approach 1:
The heat dissipation system is segmented into two independent but coordinated pathways: one for the CPU and one for the thermoelectric cooler. Each component has its own dedicated heat dissipation surface and air flow channel within the same heat sink. This segmentation allows the CPU and TEC to be cooled independently and simultaneously, enabling the TEC to operate at optimal power levels without generating excessive waste heat that would adversely affect CPU temperature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces energy consumption by minimizing unnecessary thermoelectric cooler operation, decreases waste heat impact on cooling efficiency, and eliminates the need for additional large heat dissipation modules, facilitating the development of lightweight and thin electronic products.
Implementation Method 1
The thermoelectric cooler is spaced apart from the at least one heat source and is in thermal contact with the at least one heat source through the first heat dissipation module
Implementation Method 2
The second heat dissipation module includes a fan and a heat sink. The fan of the second heat dissipation module is disposed on the heat sink
Implementation Method 3
The heat sink of the second heat dissipation module is in thermal contact with the thermoelectric cooler
Data Source
Figure 1
Figure 2
AI summary
A heat dissipation system (1) includes a first heat dissipation module (10), a second heat dissipation module (40) and a thermoelectric cooler (30). The first heat dissipation module is in thermal contact with at least one heat source (91 or 92). The second heat dissipation module includes a fan (431) and a heat sink (433). The fan of the second heat dissipation module is disposed on the heat sink. The thermoelectric cooler is spaced apart from the at least one heat source and is in thermal contact with the at least one heat source through the first heat dissipation module. The heat sink of the second heat dissipation module is in thermal contact with the thermoelectric cooler.