Heat Dissipation Apparatus with Slanted Separation Board
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Solution Overview
Problem
Conventional heat dissipation schemes for high-performance computing (HPC) systems are inefficient due to turbulent airflow and reduced heat dissipation efficiency, requiring higher costs, more power, and increased space, while also not effectively managing hot air generated by upstream circuitry.
Innovation Solution
A heat dissipation apparatus with a chassis and separation mechanism, where the first and second circuit devices are positioned on opposite sides of a slanted separation board, utilizing a fan to draw cool air in and hot air out, and employing extension mechanisms to optimize airflow and prevent hot air from mixing with cool air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If more fans are used at inlet and outlet to enhance heat dissipation, then heat dissipation efficiency is improved, but cost, power consumption and space occupation increase
Solution Approach 1:
The patent divides the circuit board into multiple layers with different orientations (first circuit board in horizontal direction, second circuit board in vertical direction). This segmentation allows airflow to be directed differently across layers, enabling efficient heat dissipation without requiring additional fans for each layer, thus resolving the contradiction between heat dissipation efficiency and device complexity.
Solution Approach 2:
The patent transitions from a single-plane circuit layout to a multi-layer three-dimensional arrangement. The second circuit board is positioned above the first circuit board in the vertical dimension, allowing airflow to pass through multiple layers sequentially. This dimensional change enables enhanced heat dissipation coverage without proportionally increasing the number of fans.
2Volume of moving object
If circuitry is located at downstream of airflow, then space utilization is improved, but turbulent air from upstream circuitry reduces airflow velocity and heat dissipation efficiency
Solution Approach 1:
The patent segments the circuit board arrangement into multiple oriented layers, where the first circuit board extends horizontally and the second circuit board extends vertically above it. This segmentation allows the downstream circuitry to be positioned in a different spatial plane, reducing the impact of turbulent airflow from upstream components and maintaining higher airflow velocity while still achieving good space utilization.
Solution Approach 2:
By positioning the second circuit board in the vertical dimension above the first circuit board, the patent utilizes three-dimensional space to arrange downstream circuitry. This dimensional transition allows airflow to pass through the horizontal layer first, then continue upward through the vertical layer, maintaining airflow velocity by reducing turbulence interference while effectively utilizing available space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency and increases airflow velocity by ensuring that cool air reaches the second circuit device directly, while preventing hot air from reducing airflow velocity and efficiency.
Implementation Method 1
A computer fan is commonly used for active cooling... which draws cool air into a computer case from outside, or moves air across a heat sink to cool a particular component
Implementation Method 2
management of which is a key issue for the HPC... enhances heat dissipation efficiency
Data Source
AI summary
A heat dissipation apparatus, adaptable to at least one first circuit device and at least one second circuit device, includes a chassis; and at least one separation mechanism disposed in the chassis, the first circuit device and the second circuit device being respectively disposed at two sides of the separation mechanism, the first circuit device being not aligned with the second circuit device, and the separation mechanism including a separation board.