Heat Dissipation Sheet Gap Design for Thermal Management
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Solution Overview
Problem
Conventional heat dissipation package structures experience deformation and reduced efficiency due to air expansion caused by thermal energy, leading to separation of the heat dissipation sheet from the chip or substrate.
Innovation Solution
A heat dissipation package structure design where the chip is not completely sealed, allowing air expansion to escape through a defined gap between the heat dissipation sheet, substrate, and chip, preventing warpage and deformation by maintaining a partial seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the chip is completely sealed by the heat dissipation sheet and substrate, then heat dissipation is improved, but air expansion causes warpage and deformation of the heat dissipation sheet
Solution Approach 1:
The patent extracts the harmful air from the sealed space by designing a gap between the heat dissipation sheet and substrate that allows air to escape. This prevents air expansion from causing warpage while maintaining effective heat dissipation through direct thermal contact between the chip, heat dissipation sheet, and substrate.
Solution Approach 2:
The patent segments the sealed space by introducing a gap region between the heat dissipation sheet and substrate. This segmentation allows the space to be divided into a heat dissipation region (in direct contact) and a gap region (allowing air escape), thereby preventing deformation while maintaining thermal efficiency.
2Loss of energy
If the heat dissipation sheet is completely sealed over the chip, then thermal energy is contained for heat dissipation, but the expanding air damages the package structure
Solution Approach 1:
The patent extracts the harmful effect of air expansion by providing an escape path through the gap between the heat dissipation sheet and substrate. This allows thermal energy to be contained for effective heat dissipation while preventing air expansion from damaging the package structure.
3Productivity
If the heat dissipation sheet is made fully sealed, then heat dissipation efficiency is improved, but warpage causes separation from the chip
Solution Approach 1:
The patent segments the sealed structure by introducing a gap region, creating a controlled non-sealed space that prevents air expansion-induced warpage. This segmentation maintains heat dissipation efficiency through direct thermal contact while preventing separation of the heat dissipation sheet from the chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by preventing sheet deformation and maintaining contact with the chip and substrate, ensuring effective thermal energy transfer without complete air entrapment.
Implementation Method 1
the chip is covered completely by a heat dissipation sheet to make the chip being within a completely sealed space formed between the heat dissipation sheet and the substrate for heat dissipation
Implementation Method 2
air is also covered in the completely sealed space in coverage process to lead the thermal energy generated from the chip expand air volume in the completely sealed space
Data Source
AI summary
A heat dissipation package structure includes a substrate, a chip disposed on the substrate and a heat dissipation sheet. The heat dissipation sheet comprises a covering portion disposed on a back surface of the chip, a first lateral covering portion disposed on a first lateral surface of the chip and a first conducting portion disposed on the substrate. The back surface comprises a first width, the covering portion comprises a second width, the chip comprises a thickness, and there is an interval between the chip and the substrate. The second width is not larger than summation of the first width, double the interval and double the thickness for making the chip disposed between the heat dissipation sheet and the substrate is not within a completely sealed space so as to prevent the heat dissipation sheet from deformation and separation from the chip or the substrate cause of air expansion.