Heat Dissipation Structure for Electronic Device Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As electronic devices integrate multiple functions and become smaller, they face challenges in effectively dissipating heat generated by high-performance components, leading to potential overheating and performance issues.
Innovation Solution
The electronic device incorporates a heat dissipation structure comprising a first printed circuit board, a second printed circuit board, an interposer, a shield can, and a heat dissipation material positioned between the circuit boards and a heat dispersion member on the outer surface, along with a heat dissipation material extending along the outer surface to manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic devices integrate multiple functions and reduce size, then device functionality and portability are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation structure is segmented into multiple functional layers: heat dissipation material layer, shield can layer, and heat dissipation fin layer. Each layer performs a specific heat management function, allowing effective heat dissipation in a compact integrated device.
Solution Approach 2:
The patent introduces vertical heat dissipation pathways through the multi-layer structure and utilizes the heat dissipation fins that extend in the vertical dimension, transforming heat dissipation from a two-dimensional surface issue to a three-dimensional volumetric solution within the compact device.
2Temperature
If heat dissipation material is added between circuit boards, then heat dissipation performance is improved, but device volume increases
Solution Approach 1:
The heat dissipation material is nested between the first and second circuit boards within the existing device volume. The shield can is positioned within the inside space defined by the interposer, and the heat dissipation fins are integrated into the shield can structure, creating a nested arrangement that maximizes heat dissipation surface area without increasing overall device volume.
Solution Approach 2:
The heat dissipation fins extend vertically from the shield can, utilizing the vertical dimension within the existing device footprint. This three-dimensional heat dissipation approach provides enhanced heat dissipation performance without increasing the device's planar volume.
3Object-affected harmful factors
If shield can is positioned between electronic component and outer surface, then electromagnetic shielding is improved, but heat dissipation path is blocked
Solution Approach 1:
The heat dissipation material serves as an intermediary between the electronic component and the shield can, conducting heat from the component to the shield can structure. The heat dissipation fins then act as an intermediary extension, providing a thermal pathway from the shield can to the external environment, thus maintaining both electromagnetic shielding and heat dissipation functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation structure effectively manages heat generated by high-performance components, preventing overheating and ensuring optimal device performance and reliability.
Implementation Method 1
a heat dissipation material positioned between the third surface and the shield can
Implementation Method 2
a heat dispersion member positioned between a first outer surface of the electronic device and the electronic component and extending along the first outer surface of the electronic device
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The disclosure relates to an electronic device. The electronic device according to an embodiment of the disclosure may include a first printed circuit board including a first surface and a second surface which is opposite the first surface, a second printed circuit board spaced apart from the first printed circuit board and including a third surface which faces the first surface and a fourth surface which is opposite the third surface, an interposer disposed between the first printed circuit board and the second printed circuit board, the interposer extending along at least a portion of an edge of the third surface to define an inside space, an electronic component mounted on the fourth surface of the second printed circuit board, a shield can mounted on the first surface of the first printed circuit board, and a heat dissipation material positioned between the third surface and the shield can.