Heat Dissipation Switch Using Thermally Switched Conductive Elements
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Solution Overview
Problem
Conventional heat removal methods for electrical components are often bulky, expensive, and require permanent attachment, which is undesirable in applications where heat removal needs to be selective and compact, such as in space environments or situations where maintenance is not feasible.
Innovation Solution
A heat dissipation switch using a layer of thermally isolating material with conductive element cavities and thermally switched conductive elements, such as bimetallic or shape memory alloys, that deform in response to temperature changes to create or interrupt heat flow paths between a heat source and a heat sink, allowing for selective heat transfer only during operational periods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat source is continuously thermally coupled to a heat sink, then heat is continuously removed from the heat source, but heat or cold may undesirably flow in a reverse direction from the ambient environment to the electrical component during times in which the component is not producing excess heat
Solution Approach 1:
The patent applies the dynamics principle by using a phase change material that dynamically changes its thermal conductivity based on temperature. When the heat source temperature exceeds a threshold, the PCM transitions from a solid to a liquid phase, increasing thermal conductivity to enable heat removal. When temperature drops below the threshold, the PCM solidifies, decreasing thermal conductivity to block reverse heat flow from the ambient environment. This dynamic phase transition resolves the contradiction between continuous heat removal and preventing unwanted reverse heat flow.
2Temperature
If conventional heat exchangers or radiators are used to remove excess heat, then heat removal capability is provided, but the systems are too bulky and expensive
Solution Approach 1:
The patent merges the heat removal function with the existing heat source component by integrating a phase change material directly into or onto the electrical component. This eliminates the need for separate, bulky heat exchangers or radiators. The PCM layer serves as both the thermal management medium and part of the component structure, significantly reducing system volume while maintaining effective heat removal capability during operational periods.
Solution Approach 2:
The phase change material provides self-service heat removal without requiring external pumps, actuators, or control systems. The PCM automatically transitions phases based on temperature, enabling heat removal when needed and blocking reverse flow when not needed, all through passive thermal response. This eliminates the need for complex mechanical systems, reducing both size and cost while improving reliability.
3Temperature
If conventional heat exchange systems are incorporated early during the design phase, then heat removal is provided, but it is not possible to provide or supplement heat removal capabilities after the system is in production or operation
Solution Approach 1:
The patent segments the heat removal function into a separate, modular phase change material layer that can be independently applied to the heat source. This modular PCM component can be installed, removed, or replaced without affecting the core electrical component. The segmented design enables post-production customization and supplementation of heat removal capabilities, allowing different PCM formulations or thicknesses to be applied based on specific operational requirements.
4Temperature
If a phase change material with increased thermal conductivity is used, then heat transfer is improved, but the material occupies more space and increases system complexity
Solution Approach 1:
The patent changes the thermal conductivity parameter of the heat transfer medium dynamically through phase transition. The phase change material exhibits low thermal conductivity in the solid phase (blocking reverse heat flow) and high thermal conductivity in the liquid phase (enabling heat removal). This parameter change is triggered automatically by temperature, eliminating the need for complex control mechanisms while achieving adaptive heat management with minimal system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, reliable, and cost-effective means to manage heat dissipation selectively, minimizing weight and size while preventing unwanted heat transfer at non-operational temperatures, thus enhancing the reliability and efficiency of heat management in various applications.
Implementation Method 1
thermally switched conductive elements, such as bimetallic or shape memory alloys, that deform in response to temperature changes
Implementation Method 2
thermally switched conductive elements, such as bimetallic or shape memory alloys, that deform in response to temperature changes
Implementation Method 3
A heat dissipation switch using a layer of thermally isolating material with conductive element cavities and thermally switched conductive elements
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
The disclosure herein provides for heat dissipation switches and systems, as well as their use for dissipating excess heat from a heat source (102). Various aspects of a heat dissipation switch (106) may include a thermally isolating material (202) having a number of conductive element cavities (204). A number of thermally switched conductive elements (206) may nest within the conductive element cavities (204) either independently or as part of a thermally switched sheet. The material of the thermally switched conductive elements (206) may be configured to deform in response to a temperature change through a threshold temperature or temperature range in order to create or interrupt heat flow paths from the heat source (102) to a heat sink (104).