Heat Dissipation Structure for Test Apparatus Thermal Management
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Solution Overview
Problem
Electronic devices in test apparatuses generate high heat during testing, leading to shortened service life and potential damage due to lack of effective heat dissipation.
Innovation Solution
A heat dissipation structure comprising bonding portions on electronic elements, a metal alloy board body with heat transfer members, and a blowing member to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electronic elements are tested without heat dissipation elements, then testing can be performed with simple structure, but electronic elements will generate high heat leading to shortened service life and early damage
Solution Approach 1:
The heat dissipation structure is divided into multiple functional segments: bonding portions (thermal pads) that contact electronic elements, a board body that conducts heat, heat transfer members (fins) that increase surface area, and a blowing member that provides forced convection. This segmentation allows each component to perform its specific heat dissipation function efficiently while maintaining overall structural simplicity for testing applications.
Solution Approach 2:
The heat dissipation structure acts as an intermediary between the electronic elements and the surrounding environment. It provides a dedicated thermal pathway through bonding portions, board body, and heat transfer members, mediating heat transfer from the electronic elements to air flow generated by the blowing member, thereby protecting electronic elements from direct thermal damage.
2Reliability
If heat dissipation elements are added to electronic elements, then temperature can be reduced and service life extended, but device complexity increases
Solution Approach 1:
The heat dissipation structure merges multiple heat dissipation functions into a single integrated assembly that can be applied to multiple electronic elements simultaneously. The bonding portions are disposed on multiple electronic elements, and the board body with heat transfer members provides unified heat conduction and dissipation, reducing overall system complexity compared to individual heat sinks for each element.
Solution Approach 2:
The heat dissipation structure serves multiple functions within a single design: thermal conduction through the board body, heat dissipation through finned heat transfer members, and forced convection through the blowing member. This multi-functionality reduces the need for separate components and simplifies the overall testing apparatus structure.
3Duration of action of moving object
If electronic elements are exposed to high temperature for long time, then testing duration can be extended, but electronic elements will suffer early damage and malfunction
Solution Approach 1:
The heat dissipation structure enables continuous heat dissipation throughout the testing process. The bonding portions maintain constant thermal contact with electronic elements, the board body continuously conducts heat away, the heat transfer members continuously dissipate heat to air, and the blowing member provides continuous forced convection. This continuous thermal management allows extended testing duration without compromising element integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation structure effectively reduces the temperature of electronic elements, preventing service life shortening and damage, while ensuring stability and reliability of temperature-sensitive elements during testing.
Implementation Method 1
bonding portions disposed on electronic elements on an electronic carrier board of the test apparatus; and a board body having a first side and a second side opposing the first side, wherein the board body is disposed on the bonding portions via the first side
Implementation Method 2
each of the heat transfer members is a plurality of fins spaced apart from and parallel to each other
Implementation Method 3
formed with heat transfer members on the second side
Implementation Method 4
the present disclosure further comprises a blowing member disposed above the second side of the board body and blowing air toward the heat transfer members
Data Source
AI summary
A heat dissipation structure is provided and includes: bonding portions disposed on electronic elements on an electronic carrier board of a test apparatus; and a board body having a first side and a second side opposing the first side, and the board body is disposed on the bonding portions via the first side and formed with heat transfer members on the second side.