Heat Dissipation Module Along Transmission Line
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Solution Overview
Problem
Electronic devices with multiple heat sinks for heat dissipation become heavy and compromise customer experience due to increased weight and bulkiness.
Innovation Solution
An electronic device design featuring a heat dissipation module along a transmission module, where the first end is within the receiving housing and the second end is outside, allowing heat generated by the function module to be transferred to the external environment, reducing the need for additional cooling components and minimizing weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heat sinks are provided in the cooling component, then heat dissipation performance is improved, but device weight increases
Solution Approach 1:
The patent combines the heat dissipation function with the transmission module by integrating a heat dissipation component along the transmission module. This merged structure allows the transmission module to serve dual purposes: signal transmission and heat conduction, thereby eliminating the need for separate multiple heat sinks and reducing overall device weight.
Solution Approach 2:
The transmission module is designed to perform multiple functions: it not only transmits signals between the first end and second end but also serves as a heat conduction path. The heat dissipation component integrated along the transmission module conducts heat from the function module to the second end, enabling the transmission module to function as both a signal carrier and a thermal management solution.
2Temperature
If multiple heat sinks are provided in the cooling component, then heat dissipation performance is improved, but device bulkiness increases
Solution Approach 1:
The patent merges the heat dissipation component with the transmission module into a single integrated structure. This combination eliminates the need for separate cooling components with multiple heat sinks, thereby reducing device bulkiness while maintaining effective heat dissipation through the integrated thermal path.
3Weight of moving object
If a heat dissipation module is integrated along the transmission module, then device weight is reduced, but heat dissipation path complexity increases
Solution Approach 1:
The transmission module serves itself by incorporating the heat dissipation component along its structure. The transmission module's own body acts as the heat conduction path, transferring heat from the function module to the second end where dissipation occurs. This self-service approach simplifies the overall system by eliminating the need for separate, complex cooling systems while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat without the need for multiple heat sinks, reducing the electronic device's weight and improving customer experience by maintaining performance while minimizing bulkiness.
Implementation Method 1
The heat dissipation module is configured to transfer heat generated by the function module to the second end of the transmission module
Data Source
AI summary
An electronic device includes a body having a receiving housing and an opening, a function module disposed in the receiving housing, a transmission module configured to transmit a signal between a first end of the transmission module and a second end of the transmission module, and a heat dissipation module disposed along the transmission module. The first end of the transmission module is located in the receiving housing, and the second end of the transmission module is located outside the receiving housing. The heat dissipation module is configured to transfer heat generated by the function module to the second end of the transmission module.