Electronic Device Heat Dissipation Unit Design
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Solution Overview
Problem
Conventional electronic devices face inefficiencies in heat dissipation due to increased heat generation from enhanced performance, requiring more powerful heat dissipation mechanisms to maintain efficiency.
Innovation Solution
An electronic device design incorporating a heat dissipation unit with a connecting portion, heat exchanger, and heat pipes that connects to the existing heat dissipation system, utilizing a water-cooling system and exposing a portion outside the housing to enhance heat dissipation efficiency without increasing the device's volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat dissipation systems are used with increased performance heat sources, then heat dissipation capacity is insufficient, but increasing the heat dissipation mechanism power increases device complexity and volume
Solution Approach 1:
The heat dissipation unit is nested within the housing structure, utilizing the side wall space for heat exchange. The connecting portion integrates with the internal heat dissipation system while the heat exchanger extends to the external environment, creating a nested configuration that improves heat dissipation without increasing overall device volume.
Solution Approach 2:
The invention transitions from internal-only heat dissipation to a three-dimensional heat dissipation architecture by extending the heat exchanger from the internal connecting portion through the housing wall to the external environment. This spatial extension in another dimension enables additional heat dissipation capacity without increasing the footprint of the device.
2Loss of energy
If conventional heat dissipation systems are used with increased performance heat sources, then heat dissipation capacity is insufficient, but increasing the heat dissipation mechanism power increases device volume
Solution Approach 1:
The heat dissipation unit is nested within the housing structure, utilizing the side wall space for heat exchange. The connecting portion integrates with the internal heat dissipation system while the heat exchanger extends to the external environment, creating a nested configuration that improves heat dissipation without increasing overall device volume.
Solution Approach 2:
The invention transitions from internal-only heat dissipation to a three-dimensional heat dissipation architecture by extending the heat exchanger from the internal connecting portion through the housing wall to the external environment. This spatial extension in another dimension enables additional heat dissipation capacity without increasing the footprint of the device.
3Loss of energy
If heat dissipation capacity is increased to handle higher performance heat sources, then heat dissipation efficiency improves, but the device requires reconfiguration of internal components
Solution Approach 1:
The heat dissipation system is segmented into distinct functional modules: the internal connecting portion that interfaces with existing heat sources, the heat pipes that transport heat, and the external heat exchanger that dissipates heat to the environment. This modular segmentation allows the heat dissipation unit to be installed as an add-on component without reconfiguring the internal arrangement of existing components.
Solution Approach 2:
The connecting portion acts as an intermediary that interfaces between the internal heat dissipation system and the external heat exchanger. This intermediary component enables thermal coupling between the existing internal components and the new external heat dissipation mechanism without requiring direct modification or reconfiguration of the internal component layout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances heat dissipation efficiency by transmitting heat to an external heat exchanger, preventing overheating and maintaining the device's size without reconfiguring internal components.
Implementation Method 1
The heat pipe connects the connecting portion with the heat exchanger
Implementation Method 2
The heat exchanger is disposed in the housing, and a portion of the heat exchanger is exposed outside of the housing
Data Source
AI summary
An electronic device and a heat dissipation unit thereof are provided. The electronic device includes a housing, a circuit board, a heat source, a heat dissipation system and a heat dissipation unit. The circuit board is disposed in the housing and the heat source is disposed on the circuit board. The heat dissipation abuts the heat source, and the heat dissipation unit, disposed on the housing, abuts the heat dissipation system, wherein a portion of the heat dissipation unit is exposed outside of the housing. The heat dissipation unit includes a connecting portion, a heat exchanger, and a heat pipe. The connecting portion, disposed in the housing, abuts the heat dissipation system. The heat exchanger is disposed in the housing, and a portion of the heat exchanger is exposed outside of the housing. The heat pipe connects the connecting portion with the heat exchanger.