Heat Dissipation Apparatus with Vacuum Cavity for Server Thermal Management
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Solution Overview
Problem
Existing heat dissipation technologies for packaged chips are inefficient due to heat transfer between chips with different heat generation rates, leading to reduced overall heat dissipation efficiency and potential overheating of lower power consumption chips.
Innovation Solution
A heat dissipation apparatus with a heat dissipation substrate and component featuring a gap between the component and the substrate, utilizing a vacuum cavity with a working substance and a porous structure to isolate heat transfer between chips, and employing partition-based heat dissipation with varying fin spacings and diverter components to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a heat dissipation substrate is used to dissipate heat for multiple chips, then the heat dissipation structure is simplified, but heat transfers between chips with different heat generation rates, reducing heat dissipation efficiency
Solution Approach 1:
The heat dissipation substrate is divided into multiple independent heat dissipation regions, each corresponding to a specific chip. Each region has its own heat dissipation fins and thermal pathways, preventing heat transfer between different chip regions. This segmentation allows each chip to be dissipated independently according to its heat generation characteristics, resolving the contradiction between structural simplicity and heat dissipation efficiency.
2Ease of manufacture
If heat dissipation fins are evenly arranged on the heat dissipation substrate, then the manufacturing process is simplified, but heat dissipation efficiency for chips with different power consumption is reduced
Solution Approach 1:
The heat dissipation fins are arranged with different densities in different regions of the substrate. Regions corresponding to high-power chips have denser fin arrangements to enhance heat dissipation capacity, while regions for low-power chips have sparser arrangements. This local differentiation optimizes heat dissipation efficiency for each chip type while maintaining a relatively simple overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces heat transfer between chips, improves heat dissipation efficiency, and prevents overheating of lower power consumption chips, thereby enhancing the overall performance and reliability of the heat dissipation apparatus.
Implementation Method 1
a vacuum cavity is disposed in the heat dissipation component. Working substance is disposed in the vacuum cavity, and the working substance is used to dissipate heat for the to-be-heat-dissipated component
Implementation Method 2
The heat dissipation fins are configured to exchange heat with the heat dissipation substrate, to dissipate heat on the heat dissipation substrate
Data Source
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AI summary
This application discloses a heat dissipation apparatus, a method for manufacturing the heat dissipation apparatus, and a server, and pertains to the field of hardware heat dissipation technologies. The heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate and in which the heat dissipation component is not disposed is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component, and the another to-be-heat-dissipated component is a component other than the first to-be-heat-dissipated component. This improves heat dissipation efficiency of the heat dissipation apparatus.