Heat Dissipation Device With Vertical Channels
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Solution Overview
Problem
Conventional heat dissipation devices for compact electronic devices, such as laptops and smartphones, face challenges in efficiently cooling components due to limited space, which restricts the use of fans and results in inadequate cooling efficiency under natural convection.
Innovation Solution
A heat dissipation device featuring a heat dissipation body with vertical channels and a cover plate with differing thermal conductivities, where the cover plate has through holes connecting to the channels, enhancing fluid flow rate through the Bernoulli effect, thereby improving cooling efficiency under natural convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of heat dissipation device is reduced to fit compact electronic devices, then the device can be integrated into slim and compact electronic devices, but the cooling efficiency deteriorates due to limited space for fans and reduced thermal contact surface
Solution Approach 1:
The heat dissipation device is segmented into multiple vertical channels within the heat dissipation body, allowing heat to be dissipated through multiple parallel pathways. This segmentation increases the effective heat dissipation surface area without increasing the overall device volume, thereby maintaining cooling efficiency in compact form factors.
Solution Approach 2:
The invention transitions from conventional horizontal heat dissipation to vertical heat dissipation channels. By utilizing the vertical dimension, the heat dissipation device achieves enhanced heat transfer efficiency without increasing the horizontal footprint, enabling effective cooling in slim and compact electronic devices.
2Reliability
If the flow rate of working fluid is increased to improve cooling efficiency, then the cooling efficiency improves, but the device complexity increases due to the need for fans
Solution Approach 1:
The heat dissipation device utilizes natural convection to drive fluid flow through the vertical channels. The heated fluid naturally rises and cooler fluid replaces it, creating a self-sustaining flow without requiring external fans or pumps. This self-service mechanism maintains cooling efficiency while avoiding the complexity of additional active cooling components.
Solution Approach 2:
The invention replaces the mechanical fan system with a natural convection-based fluid flow system. By substituting the mechanical forcing mechanism with a thermally-driven natural convection current, the device achieves the necessary fluid flow rates for effective cooling without the complexity, noise, and power consumption associated with fans.
3Device complexity
If natural convection is used for cooling in compact devices, then the device structure remains simple without fans, but the cooling efficiency deteriorates due to insufficient fluid flow rate
Solution Approach 1:
The invention maximizes the utilization of vertical space by implementing vertical heat dissipation channels. This vertical orientation enhances natural convection effectiveness by aligning the heat transfer path with the direction of buoyancy-driven fluid flow, thereby improving cooling efficiency without requiring increased device complexity.
Solution Approach 2:
The invention changes the geometric parameters of the heat dissipation structure by introducing multiple vertical channels with optimized dimensions. This parameter optimization enhances the heat transfer surface area and improves fluid flow characteristics within the natural convection regime, achieving better cooling efficiency while maintaining simple device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased fluid flow rate within the vertical channels draws in air from outside, enhancing the cooling efficiency of the heat dissipation device for compact electronic devices by leveraging the thermal conductivity difference between the cover plate and heat dissipation body materials.
Implementation Method 1
A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.
Implementation Method 2
According to the Bernoulli's equation, the higher velocity of the fluid inside the vertical channels will result in a pressure lower than that in the space outside the vertical channels, and which will draw the air outside the vertical channels into the vertical channels to increase the flow rate of the fluid in the vertical channels.
Implementation Method 3
the flow rate of the fluid flowing through the vertical channels can be increased. The increased flow rate of the fluid in the vertical channels can help improve the cooling efficiency of the heat dissipation device to the heat source under natural convection.
Data Source
AI summary
This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.