Heat Dissipation Component Warp Control via Thermal Pressing
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Solution Overview
Problem
Conventional heat dissipation components experience warping issues due to thermal expansion coefficient differences between base plates and circuit boards, leading to poor adhesion with radiating fins and inadequate heat dissipation, with significant warp return after heat cycling.
Innovation Solution
A manufacturing method for a flat plate-shaped heat dissipation component using a composite of silicon carbide and aluminum alloy, involving a concave-convex mold with a surface temperature of at least 450°C and spherical surfaces with a curvature radius of 7,000-30,000 mm, applying stress for 30 seconds or more at 10 KPa or greater to achieve a controlled warp, ensuring good adhesion and reduced warp return.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flat base plates are used for heat dissipation components, then manufacturing is simple, but the base plate surface warps concavely due to thermal expansion coefficient differences, causing poor adhesion with radiating fins
Solution Approach 1:
The patent applies preliminary warping to the base plate surface before joining radiating fins. By pre-forming the base plate with a convex warped shape, the subsequent thermal expansion during operation maintains proper contact between the radiating fins and base plate surface, preventing concave warping that would occur with flat plates.
Solution Approach 2:
The patent changes the physical parameter of the base plate surface from flat to convex warped shape. This parameter change in surface geometry compensates for the thermal expansion coefficient differences between the base plate and circuit board, ensuring continuous adhesion with radiating fins during temperature cycles.
2Manufacturing precision
If warp processing is applied to base plates before joining radiating fins, then adhesion is improved, but the warping fluctuates during heat cycling and significant warp return occurs after heat treatment
Solution Approach 1:
The patent optimizes the warping amount to a specific range (5-50 μm over 100 mm length) and controls the thermal processing parameters (heating to 450-550°C, pressing for 0.5-5 minutes at 10-50 KPa). These controlled parameter changes create a stable convex shape that maintains adhesion during heat cycling while minimizing warp return after heat treatment.
Solution Approach 2:
The patent replaces conventional mechanical warping methods with thermal-field-based warping. By heating the base plate to specific temperatures and applying controlled pressure, the thermal energy induces and stabilizes the convex warp shape, which proves more reliable during subsequent heat cycling compared to mechanical warping methods.
3Manufacturing precision
If conventional heat processing methods are used to warp base plates, then some warp is achieved, but warp return is significant causing the surface to become concave again, resulting in poor heat dissipation
Solution Approach 1:
The patent establishes specific parameter ranges for thermal processing: heating temperature of 450-550°C, pressing duration of 0.5-5 minutes, and pressing stress of 10-50 KPa. Within these optimized parameters, the base plate achieves stable convex warping that prevents warp return, ensuring the surface remains convex for effective heat dissipation.
Solution Approach 2:
The patent uses composite base plates made of aluminum alloy and silicon carbide particles. This composite material structure provides both the necessary thermal conductivity for heat dissipation and controlled thermal expansion characteristics that stabilize the warped shape during temperature cycles, preventing warp return.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in heat dissipation components with superior heat dissipation and minimal warp return, maintaining a convex shape for improved adhesion with radiating fins and high-reliability modules.
Implementation Method 1
the heat dissipation component is sandwiched in a concave-convex mold that has a surface temperature of at least 450° C. and that has a pair of opposing spherical surfaces
Implementation Method 2
the stress generated due to the difference in the thermal expansion coefficient of the base plates and the circuit boards when the two are joined or the stress generated when packaging with resin sealants, etc. thereafter causes the base plate surface side in dose contact with the radiating fins, etc. to warp concavely
Data Source
AI summary
To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.