Heat-Dissipation Member Wedging Mechanism for Electronic Device Assembly
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Solution Overview
Problem
Conventional electronic devices with heat-dissipation structures face challenges in assembly efficiency, reliability, and recyclability due to the immobility and permanent attachment of heat-dissipation members, which require setting glue and are difficult to detach and recycle.
Innovation Solution
The electronic device incorporates a heat-dissipation structure with a restriction member that is detachably connected to the housing using a wedging mechanism, reducing assembly time and effort, improving reliability, and allowing for easy detachment and recycling of the heat-dissipation member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glue is used to affix the heat-dissipation member to the housing, then the heat-dissipation member is securely attached, but the assembly time increases and the heat-dissipation member cannot be easily detached or recycled
Solution Approach 1:
The connection structure is divided into separate components: a connection portion on the heat-dissipation member and corresponding connection portions on the housing sidewalls. This segmentation allows for modular assembly without requiring glue, reducing assembly time while maintaining secure attachment through mechanical interlocking.
Solution Approach 2:
The patent replaces the chemical bonding system (glue) with a mechanical connection system. The connection portions feature protrusions and recesses that mechanically interlock, eliminating the need for adhesive setting time while ensuring reliable attachment through physical engagement.
2Reliability
If glue is used to affix the heat-dissipation member to the housing, then the heat-dissipation member is securely attached, but the heat-dissipation member cannot be easily detached or recycled
Solution Approach 1:
The connection structure transitions from a static permanent bond (glue) to a dynamic reversible connection. The mechanical interlocking design allows the heat-dissipation member to be securely attached during operation but easily detached when needed, enabling recycling and reuse without compromising attachment reliability during use.
Solution Approach 2:
The patent enables recovery and recycling of the heat-dissipation member by designing a detachable connection system. The heat-dissipation member can be removed from the housing and reused in other applications, reducing waste and improving sustainability while maintaining secure attachment during operational phases.
3Stability of the object's composition
If the heat-dissipation member is permanently attached to the housing, then the structure is stable, but the assembly process requires holding components immobile for several hours
Solution Approach 1:
The connection structure is segmented into discrete mechanical components (protrusions and recesses) that interlock immediately upon assembly. This eliminates the need for prolonged holding periods required by glue setting, allowing workers to proceed to the next assembly step right away while maintaining structural stability through the mechanical interlock.
Solution Approach 2:
The patent substitutes the time-dependent chemical bonding process with an immediate mechanical locking mechanism. The connection portions engage physically upon assembly, providing instant structural stability without requiring hours of setting time, thereby significantly improving assembly efficiency and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wedging mechanism simplifies assembly, enhances the reliability of the electronic device, and facilitates the recycling of heat-dissipation members, addressing the inefficiencies of conventional attachment methods.
Implementation Method 1
the restriction member is wedged into the second sidewall connection portion, and the second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction
Implementation Method 2
The first sidewall connection portion comprises a first sidewall recess, the heat-dissipation member connection portion comprises a heat-dissipation member protrusion, and the heat-dissipation member protrusion is adapted to be inserted into the first sidewall recess
Data Source
AI summary
An electronic device with a heat-dissipation structure is provided. The electronic device includes a housing, a heat-dissipation member, and a restriction member. The housing includes a first sidewall and a second sidewall. The first sidewall includes a first sidewall connection portion. The second sidewall includes a second sidewall connection portion. The heat-dissipation member includes a heat-dissipation member connection portion that is detachably connected to the first sidewall connection portion. The first sidewall connection portion restricts the freedom of movement of the heat-dissipation member connection portion in a first direction. The restriction member is disposed on the heat-dissipation member. The restriction member is wedged into the second sidewall connection portion. The second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction.