Heat Exchange Assembly With Integrated Resistive Heating
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Solution Overview
Problem
Current thermal management systems for electric vehicles face challenges such as high costs, space constraints, and excessive complexity due to numerous components.
Innovation Solution
A heat exchange assembly with an integrated resistive heating element on the shell surface of the heat exchange plate, which heats the cooling fluid within the cooling chamber to manage temperature, eliminating the need for a separate heating module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separate heating module is added to the cooling loop downstream of the heat exchange plate, then heating function is provided, but device complexity and number of components increase
Solution Approach 1:
The heating element is integrated directly into the heat exchange plate, merging the cooling and heating functions into a single component. This eliminates the need for a separate heating module downstream in the cooling loop, thereby reducing device complexity and component count while maintaining both cooling and heating capabilities
Solution Approach 2:
The heat exchange plate is designed to perform multiple functions: it serves as both a cooling heat exchanger and a heating element support structure. By integrating the heating element into the plate itself, the system achieves multi-functionality in a single component, allowing the same structure to provide both thermal management functions
2Adaptability or versatility
If numerous components are used in the thermal management system, then heating and cooling functions are provided, but manufacturing cost increases
Solution Approach 1:
By combining the heating element and heat exchange plate into a single integrated assembly, the manufacturing process is simplified. Fewer separate components mean fewer manufacturing steps, less assembly work, and reduced material costs, thereby lowering overall manufacturing cost while maintaining full thermal management functionality
3Adaptability or versatility
If numerous components are used in the thermal management system, then heating and cooling functions are provided, but packaging space increases
Solution Approach 1:
The integration of the heating element into the heat exchange plate creates a compact assembly that occupies less space than separate cooling and heating modules would require. This space-efficient design is particularly beneficial for mobile applications where packaging volume is constrained
Solution Approach 2:
The heating element is positioned within or on the surface of the heat exchange plate structure, effectively nesting one functional element within another. This nested arrangement maximizes space utilization and minimizes the overall volume required for the thermal management system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the number of components, lowers costs, and improves packaging by integrating the heating function into the heat exchange assembly, thus optimizing thermal management.
Implementation Method 1
a resistive heating element disposed on the outer shell surface and in thermal communication with the cooling chamber for heating the cooling fluid within the cooling chamber to increase the temperature of the cooling fluid returned to the cooling loop via the fluid outlet
Implementation Method 2
The base plate includes a first surface configured to be in thermal communication with the electronic component
Data Source
AI summary
A heat exchange assembly is configured to be coupled to a cooling loop for cooling an electronic component of a vehicle. The heat exchange assembly includes a heat exchange plate and a resistive heating element. The heat exchange plate includes a base plate configured to be in thermal communication with the electronic component, and a shell coupled to the base plate such that a cooling chamber is defined between the shell and the base plate. The shell is configured to provide a cooling fluid from the cooling loop to the cooling chamber and return the cooling fluid to the cooling loop. The resistive heating element is disposed on the shell and in thermal communication with the cooling chamber for heating the cooling fluid within the cooling chamber to increase the temperature of the cooling fluid returned to the cooling loop.


