Heat Exchanger Leaf Spring Assembly to Reduce Warping on PCB
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Solution Overview
Problem
Existing cooling systems for heat generating components on printed circuit boards suffer from warping of the heat exchanger, which reduces the contact area and deteriorates the cooling effect.
Innovation Solution
A cooling system design featuring a heat exchanger with a larger size than the heat generating component, incorporating a leaf spring and raised portions on its upper surface, which are fixed to the printed circuit board using screws, to prevent warping and enhance heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the heat exchanger is made larger than the heat generating component, then the contact area is increased, but warping occurs which reduces the effective contact area
Solution Approach 1:
The heat exchanger is divided into multiple independent support portions (first support portion, second support portion, third support portion, fourth support portion) positioned at different locations. This segmentation allows each portion to independently support the heat exchanger against warping forces, maintaining overall stability while preserving the large contact area needed for effective heat dissipation.
Solution Approach 2:
Support portions are strategically positioned at specific locations on the heat exchanger (opposite sides and diagonal positions) rather than uniformly distributed. This local quality approach provides targeted support where warping is most likely to occur, effectively preventing deformation while maintaining the overall large contact area with the heat generating component.
2Temperature
If the heat exchanger size is increased to improve cooling, then the structure becomes more prone to warping under mounting stress
Solution Approach 1:
The heat exchanger structure is segmented into multiple support portions positioned at opposite sides and diagonal locations. This segmentation distributes the mounting stress across multiple points, preventing concentrated stress that would cause warping in larger heat exchangers, thereby maintaining both cooling efficiency and structural stability.
Solution Approach 2:
The support portions are positioned asymmetrically at opposite sides and diagonal positions rather than in a symmetric pattern. This asymmetric positioning optimizes the distribution of mechanical stress across the large heat exchanger structure, preventing warping while maintaining the expanded surface area needed for effective heat dissipation.
3Device complexity
If the heat exchanger is fixed using a single screw, then the structure is simple, but the heat exchanger warps due to uneven stress distribution
Solution Approach 1:
The fixing structure is segmented into multiple screws positioned at opposite sides and diagonal locations on the heat exchanger. This segmentation distributes the clamping force across multiple points, preventing uneven stress concentration that would cause warping, while maintaining a relatively simple overall structure that is easy to assemble and maintain.
Solution Approach 2:
The leaf spring component is designed with a curved elastic structure that naturally distributes stress in a more uniform pattern when compressed by the screws. This curved geometry acts as a mechanical element that transforms point loads from the screws into distributed pressure across the heat exchanger, preventing warping without requiring complex fixing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces warping of the heat exchanger, maintaining a stable contact area and improving the cooling efficiency of the heat generating component.
Implementation Method 1
a leaf spring configured to extend from a first side of an upper surface of the heat exchanger to a second side opposite to the first side
Implementation Method 2
a heat exchanger configured to be provided on a heat generating component mounted on a printed circuit board to cool the heat generating component
Data Source
AI summary
A cooling system includes a heat exchanger provided on a heat generating component, the heat exchanger having a size larger than the heat generating component, a leaf spring to extend from a first side of an upper surface of the heat exchanger to a second side opposite to the first side, and be fixed to the upper surface of the heat exchanger, a first screw to be arranged around the heat exchanger, and to fix the leaf spring to a printed circuit board, and a convex portion to be raised to be higher than a first portion of the first side and a second portion of the second side, and to be formed at a central portion between first and second portions within a region of the upper surface of the heat exchanger that overlaps with the leaf spring.