Heat Exchanger Plate Brazing With Localized Joining-Zone Heating
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Solution Overview
Problem
Conventional heat exchanger production methods involve complete heating of components, leading to partial melting, high energy consumption, and long production times, which compromise mechanical strength and efficiency.
Innovation Solution
A method where only the joining zone of heat exchanger plates is locally heated using electrical induction, heating bars, infrared, or hot-air devices, minimizing component heating outside the zone, and employing a brazing tool with heating and cooling elements to optimize the brazing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complete heating of all heat exchanger components is used for brazing, then reliable joining of components is achieved, but partial melting of components occurs and energy consumption increases
Solution Approach 1:
The patent applies local heating instead of complete heating by positioning a heating element directly at the joining zone between heat exchanger plates. This localized thermal input melts the solder only where needed for brazing while maintaining lower temperatures in other components, thereby achieving reliable joining without excessive energy consumption or partial melting of non-joining components.
2Reliability
If complete heating of all heat exchanger components is used for brazing, then joining temperature is achieved, but production time increases
Solution Approach 1:
By concentrating heating energy precisely at the joining zone rather than heating all components uniformly, the patent achieves the required brazing temperature much faster. The localized thermal input directly heats the solder and adjacent plate surfaces at the joining interface, significantly reducing the time to reach joining temperature while maintaining high joining quality.
Solution Approach 2:
The patent applies heating only to the extent necessary for the joining operation—specifically, only the joining zone receives sufficient heat to melt the solder. This partial action approach avoids the time penalty of heating entire components unnecessarily, achieving efficient brazing in a fraction of the time required for complete component heating.
3Reliability
If complete heating of all heat exchanger components is used for brazing, then solder melting is achieved, but partial melting of components with low solidus temperature occurs
Solution Approach 1:
The patent positions the heating element to deliver thermal energy exclusively to the joining zone where solder melting is required. This spatially selective heating ensures that components with low solidus temperatures located away from the joining zone remain below their melting points, preventing partial melting damage while still achieving adequate solder flow and brazing quality at the joint interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces partial melting, significantly lowers energy consumption, and shortens manufacturing time, resulting in heat exchangers with enhanced mechanical strength and improved production efficiency.
Implementation Method 1
the at least one joining zone is locally heated by means of at least one heating element configured as electrical induction device
Implementation Method 2
the at least one joining zone is locally heated by means of at least one heating element configured as an irradiating device, in particular as an infrared irradiating device
Implementation Method 3
the at least one joining zone to be locally heated by means of at least one heating element configured as a hot-air device
Implementation Method 4
the solder is cured by cooling the at least one joining zone by means of a cooling device, in particular a cooling-air device
Data Source
AI summary
A method for producing a heat exchanger is disclosed. The method includes a) providing two heat exchanger plates of the heat exchanger that are to be joined to one another; b) wetting at least one common local joining zone of the two heat exchanger plates with solder; c) forming the heat exchanger by brazing the two heat exchanger plates via local heating of the at least one common joining zone.