Heat Exchanger Monolithic Layer Reduces Thermal Resistance
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Solution Overview
Problem
Maximizing heat transfer efficiency in heat exchangers is hindered by manufacturing limitations and regulatory restrictions against soldering between conduits, leading to suboptimal contact and increased thermal resistance due to air gaps caused by surface imperfections and tolerances.
Innovation Solution
A heat exchanger design incorporating a high thermal conductivity heat transferring layer between conduits, with an abutting side shaped to fit the conduit and a bonding side bonded to the second conduit, minimizing air gaps and enhancing direct contact, while complying with regulations by avoiding direct soldering between conduits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If solder is used to fill air gaps between mating surfaces, then heat transfer efficiency is improved, but regulatory compliance deteriorates
Solution Approach 1:
A heat transferring layer is introduced as an intermediary component between the first conduit and second conduit. This layer serves as a mediator that enables thermal coupling while avoiding direct solder contact with conduit walls, thus maintaining regulatory compliance. The heat transferring layer is bonded to both conduits, creating a thermal bridge without requiring solder to bridge the gap between mating surfaces.
2Temperature
If direct contact between conduits is maximized, then heat transfer efficiency is improved, but manufacturing precision requirements worsen
Solution Approach 1:
The invention changes the thermal contact parameter by introducing a heat transferring layer with high thermal conductivity. Instead of relying on precise mechanical contact between conduit surfaces, the layer compensates for surface imperfections and tolerance variations, maintaining consistent thermal coupling despite manufacturing variations in conduit roundness, surface finish, or alignment.
3Temperature
If heat transferring layer is added between conduits, then thermal resistance is reduced, but device complexity increases
Solution Approach 1:
The thermal coupling function is segmented into distinct components: the heat transferring layer is separated as an independent element between the first conduit and second conduit. This segmentation allows the layer to be optimized for thermal conductivity and bonding characteristics independently from the conduit structures, reducing overall system complexity while improving thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal resistance and improves heat transfer efficiency by ensuring a tighter, more consistent contact interface between conduits, enhancing the exchange of heat between fluids without violating regulatory constraints.
Implementation Method 1
a heat transferring layer disposed between the first conduit and the second conduit... the first conduit in heat exchange relationship with the second conduit via the heat transferring layer
Data Source
AI summary
There is disclosed a heat exchanger extending along a longitudinal axis, including a first conduit configured for circulating a first fluid; a second conduit configured for circulating a second fluid; and a heat transferring layer disposed between the first conduit and the second conduit. The heat transferring layer is monolithic with the second conduit. An abutting side of the heat transferring layer is in contact with the first conduit to define a surface contact interface therebetween. The abutting side is shaped to correspond to a shape of a surface of the first conduit in contact with the heat transferring layer. A thermal resistance defined between the second conduit and the heat transferring layer being less than that across the surface contact interface. The first conduit is in heat exchange relationship with the second conduit via the heat transferring layer.