Fluid Heat Exchanger Pump Layout for Faster Chip Cooling

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Solution Overview

Problem

Existing fluid heat exchangers face issues with slow fluid flow speed, heat accumulation, and mechanical malfunctions due to the accumulation of small particles, which hinder effective heat dissipation from semiconductor chips.

Innovation Solution

A fluid heat exchanger with a pump system that includes a heat conduction unit, diversion unit, and housing unit, featuring a rotating upright impeller and diversion plate, which increases fluid flow speed and contact with heat sink fins, reducing heat accumulation and mechanical wear.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a rotor with blades is used in the fluid heat exchanger, then the fluid can be driven to flow, but small particles accumulate and wear the rotor causing mechanical malfunctions

Engineering Contradiction:
Improvefluid flow speedVSAvoidmechanical malfunction resistance
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent extracts the shaft and rotor assembly from the housing, eliminating the mechanical components that are susceptible to particle wear. The fluid is driven without a traditional rotating shaft penetrating the housing, thus removing the source of mechanical malfunctions while maintaining fluid circulation capability

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical rotor-blade system with a magnetic field-driven system. A magnet rotates inside the housing to drive the fluid through magnetic interaction with the fluid, eliminating direct mechanical contact between moving parts and the fluid, thus preventing particle accumulation and wear on mechanical components

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Speed

If the fluid flows from the periphery of the heat conductor to the center, then the fluid is driven by centrifugal force, but heat accumulates in the center of the semiconductor chip

Engineering Contradiction:
Improvefluid flow speedVSAvoidheat accumulation
Core Design Contradiction:
SpeedVSTemperature

Solution Approach 1:

The patent inverts the conventional flow direction by using a magnet that rotates in the opposite direction or by positioning the magnet to create a flow pattern where fluid moves from the center toward the periphery. This reversal ensures that hot fluid does not accumulate in the center region where the semiconductor chip is located, effectively removing heat from the critical area

Inventive Principle:
Principle #13The other way round (Inversion)

3Productivity

If the shaft is inserted in the housing and the rotor rotates in the fluid, then the fluid can be pumped, but particles accumulate and wear the rotor

Engineering Contradiction:
Improvefluid pumping capabilityVSAvoidmechanical durability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces a magnetic field as an intermediary between the power source and the fluid. Instead of direct mechanical contact between the shaft and fluid, a magnet rotates inside the housing and transfers energy to the fluid through magnetic interaction. This intermediary approach maintains pumping capability while eliminating mechanical wear from particle accumulation

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances fluid flow speed, improves heat dissipation efficiency, and increases the durability of the system by reducing hydrodynamic losses and preventing particle accumulation on moving parts.

Implementation Method 1

the rotation direction of the upright impeller defines a rotation plane, and the rotation direction of the upright impeller is perpendicular to the setting direction of the diversion plate. When the upright impeller rotates, the fluid is pushed out by the centrifugal force

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Implementation Method 2

a heat conduction unit (3), a diversion unit (4), a housing unit (5)... effectively conducts the heat generated by the semiconductor to the outside

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11953274B2Fluid heat exchanger with pump
Publication Date: 2024.04.09 CORSAIR MEMORY INC(US)
  • US11953274B2 patent drawing
  • US11953274B2 patent drawing
  • US11953274B2 patent drawing

AI summary

A fluid heat exchanger with pump, adapted to drive a fluid for heat transfer, comprises a heat conduction unit, a diversion unit, and a housing unit. The heat conduction unit includes a heat conductor. The diversion unit includes a cover and a diversion plate. A cooling chamber is defined by the cover and the heat conductor. The cover is provided with a fluid stopper. The diversion plate is disposed in the cooling chamber, and one end of the diversion plate abuts against the fluid stopper, so that the cooling chamber is divided into an upper passage and a lower passage. The housing unit includes a housing and a pump module. The fluid in the housing is driven by the pump module to flow through the upper passage to the lower passage, and then the fluid returns to the housing to carry the heat from the heat conductor.