Heat Exchanger Assemblies for Spatial Power-Combining Devices
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Solution Overview
Problem
Conventional spatial power-combining devices face challenges in thermal management, leading to increased operating temperatures and reduced performance and lifetime due to inadequate heat dissipation.
Innovation Solution
A heat exchanger assembly with a heat transfer body and cover structure forming enclosed fluid conduits, tailored to the thermal requirements of spatial power-combining devices, is thermally coupled to the center waveguide section to enhance heat dissipation. The heat transfer body has open passageways that are selectively formed and enclosed to create complex patterns for efficient cooling, with methods including chemical etching, laser machining, and multi-axis machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management approaches are used in spatial power-combining devices, then device simplicity is maintained, but operating temperatures increase and performance deteriorates
Solution Approach 1:
The heat transfer body is segmented into multiple regions with distinct open passageway patterns, allowing different areas to be optimized for their specific thermal requirements. This segmentation enables tailored cooling solutions for different amplifier locations within the spatial power-combining device.
Solution Approach 2:
The patent implements local quality by creating region-specific open passageway patterns that match the thermal characteristics of underlying amplifiers. High-power amplifiers receive enhanced cooling through denser passageway patterns, while lower-power areas have correspondingly reduced cooling infrastructure.
2Reliability
If heat exchanger assemblies are added to spatial power-combining devices, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat exchanger assembly merges the heat transfer body, open passageways, and cover structure into an integrated thermal management system. This consolidation improves thermal coupling between amplifiers and cooling channels while reducing the number of separate components that would increase complexity.
Solution Approach 2:
The heat transfer body serves multiple functions: it acts as a structural support element, a thermal conduction path, and a housing for the open passageway cooling network. This multi-functionality reduces the need for additional separate components.
3Loss of energy
If standard cooling configurations are used, then manufacturing simplicity is maintained, but thermal efficiency is insufficient
Solution Approach 1:
The open passageways are formed in the heat transfer body before final assembly, allowing precise positioning and optimization of cooling channels. This preliminary formation enables complex thermal patterns to be created using standard manufacturing processes rather than requiring post-assembly modifications.
Solution Approach 2:
The patent replaces complex mechanical cooling channel formation with chemical etching or laser machining processes. These substitution methods enable intricate open passageway patterns to be created more efficiently than traditional mechanical machining, improving thermal efficiency without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat exchanger assembly effectively reduces operating temperatures and improves thermal management in spatial power-combining devices by providing tailored cooling solutions, enhancing the performance and longevity of amplifiers.
Implementation Method 1
heat exchanger assembly that is thermally coupled to a center waveguide section of a spatial power-combining device
Implementation Method 2
enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation
Data Source
AI summary
Heat exchanger assemblies for electronic devices and related methods are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways, and a cover structure attached to the heat transfer body that encloses the open passageways, thereby forming enclosed fluid conduits. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. Related methods include forming open passageways by selectively removing material from a face of a heat transfer body. Multiple heat transfer bodies may be formed simultaneously by forming multiple groups or patterns of open passageways across a larger area of a heat transfer body material, and subsequently singulating the heat transfer body material into multiple heat transfer bodies. Cover structures as previously described may be formed on the heat transfer bodies before or after singulation.