Heat Flow Sensor Thermal Bridge Design for Material Adaptability

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Solution Overview

Problem

Existing heat flux sensors are significantly influenced by micro-effects due to variations in thermal conductivity, requiring calibration for different materials, which limits their versatility and accuracy.

Innovation Solution

A heat flow sensor design featuring a thermopile with thermocouples connected in series, thermally conductive pads, and pillars that distribute heat energy and reduce thermal resistance, minimizing the impact of micro-effects and allowing the sensor to operate effectively across various materials without recalibration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the sensor is attached to materials with different thermal conductivities, then the sensor can measure heat flux in various applications, but the output varies significantly due to micro effects

Engineering Contradiction:

Improveapplicability to different materialsVSAvoidoutput consistency

Core Design Contradiction:

Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent modifies the thermal conductivity parameter of the insulating layers to create a controlled thermal bridge effect. By adjusting the thermal conductivity of the insulating material, the sensor compensates for variations in the thermal conductivity of the measured object, maintaining consistent output across different materials.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces an intermediary thermal bridge structure consisting of the insulating layers and conductive pads that mediates between the thermocouples and the measured object. This thermal bridge acts as a buffer that decouples the sensor output from direct dependence on the object's thermal conductivity, reducing micro effects.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Use of energy by moving object

If thermally conductive pads are placed close to thermocouples, then heat distribution is improved, but thermal short circuits increase reducing measurement accuracy

Engineering Contradiction:

Improveheat distribution efficiencyVSAvoidmeasurement accuracy

Core Design Contradiction:

Use of energy by moving objectVSMeasurement precision

Solution Approach 1:

The patent introduces thermally conductive pads as intermediary elements between the thermocouples and the measured object. These pads distribute heat more evenly across the thermocouple junctions without creating direct thermal short circuits, as they are positioned and dimensioned to optimize heat distribution while maintaining measurement accuracy.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sensor provides improved signal-to-noise ratio and sensitivity, enabling accurate heat flux measurements across different materials with reduced dependence on thermal insulation properties, and maintains output consistency when attached to objects with varying densities.

Implementation Method 1

a thermopile comprising a plurality of thermocouples connected in series

Methodology Applied

Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 2

Each of the thermally conductive first and second pads is adapted for distributing energy incident thereon along the surface of the pad

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a plurality of thermally conductive first pillars, wherein each first pillar extends from one of said thermocouples at least partially into the first layer and is attached to a corresponding one of the first pads

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10957839B2Heat flow sensor and method of manufacture thereof

Publication Date: 2021.03.23 HUKSEFLUX HLDG BV

AI summary

Heat flow sensor comprising a thermopile with a series of thermocouples and having a first side and an opposite second side, a first electrically and thermally insulating layer arranged on the first side; a second electrically and thermally insulating layer arranged on the second side; a plurality of first thermally conductive pads spaced apart from the thermopile by the first layer and extending substantially parallel to the first side; a plurality of second thermally conductive pads spaced apart from the thermopile by the second layer and extending substantially parallel to second side; a plurality of thermally conductive first pillars, wherein each first pillar extends from one of said thermocouples at least partially into the first layer and is attached to a corresponding one of the first pads and has a length greater than a thickness of the corresponding first pad.