Heat Flux Sensor Cavity Design for Non-Invasive Core Temperature
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Solution Overview
Problem
Existing wearable devices struggle to accurately measure core body temperature without invasive methods, often relying on skin temperature measurements that are not precise enough for reliable medical insights.
Innovation Solution
A heat flux sensor device comprising a semiconductor substrate layer and a cap layer with integrated thermal sensors that measure thermal energy differences to calculate core temperature, combined with signal processing circuitry to compensate for parasitic thermal fluxes and infrared radiation, allowing for non-invasive core temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If skin temperature measurement is used in wearable devices, then the device can measure temperature non-invasively, but the measurement precision is insufficient for core body temperature
Solution Approach 1:
The patent introduces a thermal coupling element as an intermediary between the skin surface and the thermal sensor. This element conducts heat from the skin to the sensor while maintaining physical separation, enabling non-invasive measurement with improved precision by mediating the thermal energy transfer without direct sensor-skin contact
Solution Approach 2:
The patent replaces direct mechanical contact measurement (sensor touching skin) with indirect thermal coupling measurement. By substituting the mechanical contact system with a thermal conduction system through a coupling element, the device achieves both non-invasive operation and enhanced measurement precision
2Measurement precision
If thermal sensors are placed in direct contact with skin, then measurement precision improves, but the device becomes invasive and less comfortable
Solution Approach 1:
The thermal coupling element serves as a mediator that enables precise temperature measurement without direct sensor-skin contact. It transmits thermal energy from the skin to the sensor while maintaining physical separation, thus preserving comfort and non-invasive operation while achieving high measurement precision
Solution Approach 2:
The patent substitutes the direct mechanical contact approach with an indirect thermal conduction approach. By replacing the mechanical contact system with a thermal coupling system, the device maintains measurement precision while eliminating the invasiveness and discomfort associated with direct contact
3Reliability
If a chamber is formed to contain thermal sensor elements, then the sensors are protected and can operate in controlled conditions, but the device complexity increases
Solution Approach 1:
The chamber structure is designed to serve multiple functions simultaneously: it protects the thermal sensor elements, maintains the vacuum environment for optimal sensor operation, and provides a mounting structure for the thermal coupling element. By combining these functions into a single integrated component, the patent reduces overall device complexity while maintaining sensor reliability
Solution Approach 2:
The patent merges the protective chamber, vacuum seal, and sensor mounting structure into an integrated assembly. By combining these previously separate functions into a unified structure, the device complexity is reduced while the reliability and operational stability of the thermal sensors are maintained
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and instantaneous core body temperature measurement suitable for wearable devices, providing reliable health monitoring without the need for invasive procedures.
Implementation Method 1
a first thermal sensor element disposed within the first cavity and configured to translate, when in use, thermal energy proportional to a temperature difference between the cap layer and the semiconductor substrate layer into first electrical energy
Implementation Method 2
heat flux sensor device comprising a semiconductor substrate layer and a cap layer with integrated thermal sensors that measure thermal energy differences to calculate core temperature
Implementation Method 3
wherein the first cavity is opaque, when in use, to infrared electromagnetic radiation incident from the reception side of the cap layer
Data Source
AI summary
A heat flux sensor device (100) comprising a semiconductor substrate layer (104) and a cap layer (102) that has a substrate-facing side (106) and a reception side (108). The cap layer (102) is bonded on the substrate-facing side (106) to the substrate layer (104), and the substrate layer (104) and the cap layer (102) together defining a first cavity (116). A first thermal sensor element (120, 122) is disposed within the first cavity (116) and configured to translate thermal energy proportional to a temperature difference between the cap layer (102) and the substrate layer (104) into first electrical energy. Signal processing circuitry is provided operably coupled to the first thermal sensor element (120, 122) and configured to use the first electrical energy generated by the first thermal sensor element (120, 122) to measure a heat flux flowing from the cap layer (102) to the substrate layer (104). The first cavity (116) is opaque to infrared electromagnetic radiation incident from the reception side (108) of the cap layer (102).