Heat-Generating Component Base Assembly with Floating Connector

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Solution Overview

Problem

Existing electrical systems face challenges in effectively cooling and protecting sensitive electronic components from heat and environmental contaminants, as direct mounting of heat-generating components on circuit boards can degrade performance and reduce lifespan, and traditional cooling systems are inefficient or require frequent maintenance.

Innovation Solution

A heat-generating electrical component and base assembly is secured to a component wall with a floating electrical connector and gasket, allowing for hermetic sealing and easy electrical connection to a circuit board, while separating heat-generating components from sensitive electronics within a split enclosure system, enabling efficient cooling and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If heat-generating components are directly mounted on circuit boards, then electrical connection is simplified, but the electronic components are damaged by heat and contaminants

Engineering Contradiction:
Improvemounting complexityVSAvoidheat damage to electronic components
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The system is divided into two separate sections: a first section containing heat-generating components and a second section containing sensitive electronic components on circuit boards. These sections are physically separated by an enclosure partition, allowing each to operate in its optimal environment without mutual interference. The partition acts as a barrier that segments the harmful thermal effects from the sensitive electronics.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An enclosure partition serves as an intermediary structure between the heat-generating components and the sensitive electronic components. This partition not only provides physical separation but also facilitates controlled thermal management and environmental protection, allowing heat to be managed in the first section while protecting the second section from excessive heat and contaminants.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If traditional cooling systems are used, then heat is removed from components, but the systems are inefficient or require frequent maintenance

Engineering Contradiction:
Improveheat removal from componentsVSAvoidcooling system efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The enclosure is segmented into a first section for heat-generating components and a second section for sensitive electronics. This segmentation allows for dedicated thermal management strategies in each section, where the first section can be designed with appropriate cooling provisions without compromising the environmental stability required by the second section.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different environmental conditions are provided in different sections of the enclosure. The first section is designed to accommodate higher temperatures and heat dissipation requirements, while the second section maintains a controlled, stable environment suitable for sensitive electronic components. This local differentiation of environmental quality optimizes both heat removal and component protection.

Inventive Principle:
Principle #3Local quality

3Reliability

If heat-generating components are separated from sensitive electronics, then component protection is improved, but system complexity increases

Engineering Contradiction:
Improvecomponent protection from heat and contaminantsVSAvoidenclosure structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A simple partition wall divides the enclosure into two functional sections, creating physical separation between heat-generating components and sensitive electronics. This segmentation approach provides effective protection while maintaining a relatively simple overall structure that does not require complex mechanisms or additional components.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The enclosure partition serves multiple functions simultaneously: it provides physical separation for thermal management, acts as a structural support element, enables modular assembly, and facilitates electrical connections between sections. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Object-affected harmful factors

If hermetic sealing is implemented, then environmental protection is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveprotection from environmental contaminantsVSAvoidassembly complexity
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The enclosure is divided into separate sections that can be independently assembled and sealed. This segmentation allows for hermetic sealing of each section independently, which simplifies the manufacturing process compared to attempting to seal a large integrated structure. Each section can be sealed using standard techniques and then assembled together.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Components are pre-assembled within their respective enclosure sections before final assembly of the complete system. The heat-generating components are installed and sealed in the first section, and the circuit boards are installed and sealed in the second section. This preliminary assembly approach simplifies the overall manufacturing process and enables quality control at intermediate stages.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a simple, cost-effective, and reliable method for connecting heat-generating components to circuit boards, maintaining a controlled environment for sensitive electronics, and improving the overall efficiency and reliability of high-power electronic systems by separating heat-generating components from sensitive electronics.

Implementation Method 1

a gasket circumscribing a perimeter of the lower portion... configured to form a hermetic seal about the aperture in the component wall

Methodology Applied
Scientific EffectHermetic sealing:

Implementation Method 2

floating electrical connector... allowing for hermetic sealing and easy electrical connection

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS9934899B2Electronics system and method of forming same
Publication Date: 2018.04.03 SCHNEIDER ELECTRIC SOLAR INVERTERS USA INC
  • US9934899B2 patent drawing
  • US9934899B2 patent drawing
  • US9934899B2 patent drawing

AI summary

Embodiments disclosed herein include systems and methods for mounting electrical components in electrical systems. In one example, there is provided a heat-generating electrical component and base assembly configured to be secured to a component wall. The assembly comprises a base including an upper portion having a recess and a lower portion having a floating electrical connector, a heat-generating electrical component secured in the recess of the base and including an electrical lead in electrical communication with the floating electrical connector, and a gasket circumscribing a perimeter of the lower portion.