Heat Insulating Assembly Constriction for Pressure Control
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Solution Overview
Problem
In substrate processing, sudden pressure fluctuations can cause film cracking at the furnace opening, leading to particles falling on substrates, which affects the integrity and quality of the semiconductor manufacturing process.
Innovation Solution
A substrate processing apparatus is designed with a heat insulating assembly featuring a constriction at the intermediate exhaust opening, along with a supply chamber exhaust port and a gas discharger, to manage pressure fluctuations and reduce particle fallout by optimizing the flow of purge gases and process gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional substrate processing apparatus is used, then substrate processing can be performed, but sudden pressure fluctuations cause film cracking and particle fallout at the furnace opening
Solution Approach 1:
The exhaust system is segmented into multiple independent exhaust openings (first exhaust opening at upper position, second exhaust opening at lower position) allowing separate control of gas flow at different locations. This segmentation enables targeted pressure control at the furnace opening region without affecting the entire chamber, preventing film cracking and particle fallout while maintaining processing reliability
Solution Approach 2:
A heat insulating assembly with a specific outer diameter is introduced as an intermediary component between the substrate retainer and the second exhaust opening. This intermediary structure modifies the gas flow path and pressure distribution in the lower region, helping to stabilize pressure at the furnace opening and prevent harmful pressure fluctuations that cause film cracking
2Reliability
If pressure control is implemented to prevent film cracking, then film integrity improves, but device complexity increases due to additional exhaust openings and heat insulating assembly
Solution Approach 1:
The heat insulating assembly serves multiple functions simultaneously: it provides thermal insulation, structures the gas flow path, modifies pressure distribution, and positions the second exhaust opening. By combining these functions into a single component, the design achieves effective pressure control without proportionally increasing device complexity
Solution Approach 2:
The second exhaust opening is nested within or positioned relative to the heat insulating assembly, which itself is positioned within the process chamber. This nested arrangement allows compact integration of multiple functional elements (exhaust opening, heat insulating assembly, gas flow path) without requiring separate dedicated structures for each function, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces particle fallout on substrates during film processing, ensuring better film quality and process stability by controlling pressure gradients and gas flow dynamics.
Implementation Method 1
a heat insulating assembly provided below the substrate retainer
Implementation Method 2
controlling pressure gradients and gas flow dynamics
Data Source
AI summary
According to the technique of the disclosure, there is provided a substrate processing apparatus including: a substrate retainer; a heat insulating assembly; a process chamber; a gas supplier including openings bored toward the wafer; a gas discharger including main exhaust openings bored toward the wafer; an exhaust port; an intermediate exhaust opening provided on a side wall of the process chamber at a position facing the heat insulating assembly; and a supply chamber exhaust port provided on the side wall of the process chamber at a height corresponding to the intermediate exhaust opening. The heat insulating assembly includes a constriction at a position corresponding to the intermediate exhaust opening, wherein its outer diameter is smaller than that of a portion of the heat insulating assembly above the position and that of another portion of the heat insulating assembly below the position.