Heat-Medium Pressure Feedback for Stable Substrate Temperature Control

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in maintaining stable temperature controllability due to variations in pressure within the circulation lines of heat media, leading to unstable pump operations and excessive heat loss, which deteriorate temperature control performance.

Innovation Solution

A temperature controller system that includes a supply and return line configuration with pressure sensors and pumps, controlled by a controller to manage discharge pressure based on detected pressure differences, ensuring consistent pressure and improved temperature control through feedback mechanisms.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If pressure control is not implemented in the heat medium circulation system, then the system structure remains simple, but temperature controllability deteriorates due to pressure variations

Engineering Contradiction:
Improvetemperature controllabilityVSAvoidsystem structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent implements feedback control by detecting the actual discharge pressure of the pump with a pressure sensor and comparing it to a target pressure value. The controller adjusts the pump operation based on the pressure difference to maintain stable pressure in the heat medium circulation system, thereby improving temperature controllability without excessive system complexity

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent changes the control parameter from direct temperature control to pressure control of the heat medium. By controlling the discharge pressure of the pump to a target value, the system indirectly achieves better temperature controllability of the substrate support, as pressure stability ensures consistent heat medium delivery

Inventive Principle:
Principle #35Parameter changes

2Loss of energy

If pump discharge pressure varies, then the system operation is simpler without pressure control, but heat loss increases and temperature control performance deteriorates

Engineering Contradiction:
Improveheat lossVSAvoidtemperature control performance
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The feedback control mechanism continuously monitors discharge pressure and adjusts pump operation to maintain target pressure. This ensures consistent heat medium circulation, reducing unnecessary heat loss while maintaining reliable temperature control performance of the substrate support

Inventive Principle:
Principle #23Feedback

3Measurement precision

If pressure sensor is installed immediately after the pump, then discharge pressure can be controlled accurately, but the system requires additional components

Engineering Contradiction:
Improvepressure detection accuracyVSAvoidnumber of components
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The pressure sensor is strategically installed immediately after the pump discharge to directly measure the pressure being controlled. This positioning provides accurate feedback for pressure control while minimizing the number of sensors needed, as one well-placed sensor captures the critical pressure parameter

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The pressure sensor is placed at the specific location where pressure control is most critical - immediately after the pump discharge. This localized measurement provides the most relevant data for controlling pump operation, ensuring accurate pressure control without needing sensors throughout the entire circulation system

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enhances temperature controllability by stabilizing pressure variations, reducing alarm stops, and minimizing heat loss, thereby maintaining precise temperature control during substrate processing.

Implementation Method 1

a pressure sensor configured to detect a pressure in the supply line disposed immediately after the pump

Methodology Applied
Scientific EffectPressure detection:

Implementation Method 2

a pump configured to discharge the heat medium to the supply line

Methodology Applied
Scientific EffectPumping: Pump

Implementation Method 3

temperature control is performed by circulating brine that is a heat medium through a flow path in a substrate support

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS12406835B2Temperature controller, substrate processing apparatus, and pressure control method
Publication Date: 2025.09.02 TOKYO ELECTRON LTD
  • US12406835B2 patent drawing
  • US12406835B2 patent drawing
  • US12406835B2 patent drawing

AI summary

A temperature controller includes a supply line configured to supply a heat medium to at least one control target, a return line configured to return the heat medium from control target, a pump configured to discharge the heat medium to the supply line, a pressure sensor configured to detect a pressure in the supply line disposed immediately after the pump, and a controller. The controller is configured to control the temperature controller to control a discharge pressure of the pump based on a difference between the pressure detected by the pressure sensor and a set value of the discharge pressure of the pump.