Heat Medium Tank Layout for Stable Substrate Temperature Control
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Solution Overview
Problem
Existing substrate processing apparatuses experience significant energy loss due to non-uniform return circulation of heat media between tanks with large temperature differences, caused by volume changes, valve operations, and heat medium evaporation/liquefaction, leading to inefficient temperature control.
Innovation Solution
A communication pipe system connects the tanks on the high and low temperature sides, maintaining liquid levels within a controlled range to prevent mixing and minimize energy loss by limiting the movement of heat media between tanks with different temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If tanks on the high temperature side and low temperature side are connected with a communication pipe for liquid level control, then liquid level can be regulated, but heat medium moves excessively between tanks causing energy loss
Solution Approach 1:
The communication pipe is positioned at a specific height corresponding to the upper limit level to enable liquid level control, while the lower limit level positioning prevents excessive heat medium movement. This local quality approach allows the system to achieve both liquid level regulation and energy conservation by carefully selecting the pipe position.
2Temperature
If heat medium is circulated between tanks with large temperature differences, then temperature control is achieved, but volume changes and evaporation/liquefaction cause non-uniform return circulation
Solution Approach 1:
The system utilizes volume changes of the heat medium due to temperature differences and evaporation/liquefaction phenomena as functional parameters. By positioning the communication pipe at the upper limit level, the invention accommodates these parameter changes while maintaining stable liquid levels and uniform heat medium circulation between tanks.
3Temperature
If liquid level adjustment tank system is used for temperature control, then temperature regulation is improved, but device complexity increases
Solution Approach 1:
The communication pipe system enables automatic liquid level adjustment between the high temperature side tank and low temperature side tank without requiring external control mechanisms. The heat medium automatically flows to equalize levels, providing self-service liquid level control that simplifies the overall device structure while maintaining effective temperature regulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces energy loss by maintaining stable temperature control and preventing excessive heat medium movement, thereby optimizing temperature regulation in the substrate processing apparatus.
Implementation Method 1
a first communication pipe configured to connect a position where an upper limit level of a height of a liquid level is located in an interior of the first tank and a position where a lower limit level of a height of a liquid level is located in an interior of the second tank
Implementation Method 2
a chiller that performs temperature control by supplying a high-temperature heat medium and a low-temperature heat medium to a flow path inside a stage by a pump and circulating them through the flow path
Implementation Method 3
circulating them through the flow path
Data Source
AI summary
A temperature control device includes a first tank that stores a first heat medium; a second tank that stores a second heat medium having a temperature different from a temperature of the first heat medium, and a first communication pipe configured to connect a position where an upper limit level of a height of a liquid level is located in an interior of the first tank and a position where a lower limit level of a height of a liquid level is located in an interior of the second tank.