Heat Dissipation Module Layout for Compact Power Converters
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Solution Overview
Problem
The existing power conversion devices face challenges in efficiently dissipating heat due to the narrow space inside the housing, which hinders the arrangement of electronic components and heat dissipation members, and the heat is often blocked by the printed circuit board, impeding proper convective heat dissipation.
Innovation Solution
A heat dissipation module is designed with a heating element, a heat dissipation member comprising a first and second plate with fins, and a heat transfer path that includes multiple unit paths and connecting paths to efficiently transfer heat from the heating element to the heat dissipation member, while also securely arranging other components like the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation member is disposed in the housing to absorb heat from electronic components, then heat dissipation capability is improved, but the available space for arranging electronic components is reduced
Solution Approach 1:
The housing structure is merged with the heat dissipation member by forming protrusions on the housing inner surface that directly contact the electronic components. This integration eliminates the need for separate heat dissipation components while maintaining effective heat transfer pathways.
Solution Approach 2:
The housing serves multiple functions: it provides structural enclosure, creates mounting spaces for electronic components through recesses, and acts as a heat dissipation member through its protrusions. This multi-functionality resolves the space conflict by making the housing itself the heat dissipation solution.
2Volume of moving object
If electronic components and printed circuit board are arranged in a compact manner, then device miniaturization is achieved, but heat dissipation through convection is blocked
Solution Approach 1:
The housing inner surface is designed with localized protrusions positioned specifically around heat-generating electronic components. These localized structures create direct heat transfer pathways without requiring overall housing redesign, enabling effective heat dissipation in compact configurations.
Solution Approach 2:
The protrusions act as intermediary heat transfer structures between the electronic components and the housing. They extend into the spaces around components to establish thermal contact pathways, facilitating heat dissipation even when components are tightly packed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively enhances heat dissipation efficiency by creating a structured heat dissipation path and securely arranging other components, thereby improving the overall performance of the power conversion device and securing a wider space inside the housing.
Implementation Method 1
a heat transfer path for transferring the heat generated from the heating element to the heat dissipation member
Implementation Method 2
heat dissipation through convection does not proceed properly
Data Source
AI summary
A heat dissipation module comprises: a heating element; a heat dissipation member disposed on one side of the heating element and including a first plate and a second plate; a third plate disposed on one side of the heating element; and a heat transfer path for transferring the heat generated from the heating element to the heat dissipation member. The heat transfer path comprises: a first path disposed between the first plate and the second plate; a third path disposed within the third plate; and a plurality of unit heat transfer paths having a second path connecting the first path and the third path, wherein the respective second paths of the plurality of unit heat transfer paths are spaced apart from each other.