Heat Module With Radial Heat Sink And Axial Gap
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Solution Overview
Problem
The challenge is to enhance the cooling capabilities of heat modules in compact devices such as thinner notebook PCs and servers, where the heat sink's surface area and air volume need to be increased while maintaining a reduced thickness, without increasing noise or size, due to the growing heat generation from high-performance SoCs and SSDs.
Innovation Solution
A heat module design incorporating a centrifugal fan with an impeller, a heat sink with fins, and a heat transfer member, featuring a thermally conductive housing and axial gap with connection portions to optimize air flow and heat dissipation, using a combination of air-cooled and thermally conductive methods to efficiently transfer heat from the heat source to the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the surface area of the heat sink is increased to improve heat dissipation capacity, then the cooling performance is improved, but the thickness of the heat module increases which conflicts with the requirement for compact device size
Solution Approach 1:
The heat transfer member is positioned within the housing to overlap with the fan in plan view, nesting the heat dissipation function within the existing fan housing space. This allows the heat sink to be arranged radially outside the air outlet without increasing the overall module thickness, as the heat transfer path is integrated within the compact radial space of the centrifugal fan structure.
Solution Approach 2:
Instead of increasing heat sink surface area in the axial direction (thickness), the invention utilizes the radial dimension by arranging the heat sink radially outside the air outlet. The heat transfer member extends radially to contact the heat source, and the heat sink fins are positioned in the radial direction where air flow from the centrifugal fan can effectively cool them without increasing axial thickness.
2Reliability
If the air volume of the blower fan is increased to improve cooling capability, then the heat dissipation capacity is improved, but the device size increases or noise level rises
Solution Approach 1:
The invention changes the operating parameters of the centrifugal fan by optimizing the axial gap between the heat transfer member and the lower plate portion. This gap optimization allows the fan to operate at reduced rotation rates while maintaining effective cooling, as the controlled air flow path through the connection portions improves air utilization efficiency. The heat sink fins are positioned to maximize exposure to the air flow generated by the fan without requiring increased fan size or speed.
3Reliability
If the rotation rate of the blower fan is increased to improve air volume, then the cooling performance is improved, but noise increases
Solution Approach 1:
The heat transfer member acts as an intermediary that efficiently transfers heat from the heat source to the heat sink while being positioned to overlap with the fan. The connection portions with optimized axial gaps create an intermediate air flow path that improves cooling efficiency at lower fan rotation rates, thereby reducing noise. The heat transfer member mediates between the heat source and heat sink, allowing effective heat dissipation without requiring high-velocity air flow that would generate noise.
4Reliability
If the heat dissipation capacity is increased to handle higher heat generation from SoCs, then the cooling performance is improved, but the device thickness increases
Solution Approach 1:
The invention merges the heat dissipation function with the existing fan housing structure. The heat transfer member is integrated within the housing space, overlapping with the fan in plan view, and the heat sink is positioned radially outside the air outlet. This merging of functions allows the heat dissipation system to handle high heat generation from SoCs without increasing device thickness, as the heat transfer path is consolidated within the compact radial space of the centrifugal fan assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved cooling performance by increasing the heat dissipation capacity while maintaining a compact form factor, reducing noise, and enhancing the efficiency of heat transfer through precise axial gap management and air flow optimization.
Implementation Method 1
a heat transfer member (6) including a lower surface capable of being in thermal contact with a heat source (8), and an upper surface thermally connected to the heat sink (5)
Implementation Method 2
cause an air current generated by a cooling fan to strike the heat sink to accomplish air cooling
Data Source
AI summary
A heat module includes a fan, a heat sink, a heat transfer member, and a plurality of connection portions. The heat transfer member includes a lower surface capable of being in thermal contact with a heat source, and an upper surface thermally connected to the heat sink, and is arranged to overlap with at least a portion of the fan in a plan view. The plurality of connection portions are arranged between the heat transfer member and the housing to define an axial gap between an upper surface of the heat transfer member and a lower surface of the lower plate portion. The heat transfer member includes a heat source contact portion arranged on a side, closer to the fan, of an end portion of the fan at which the air outlet is defined.