Heat Dissipating Module Structure for Resin Bond Reliability
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Solution Overview
Problem
Existing heat dissipation structures for ICs face reliability issues due to separation between heat dissipation plates and sealing resins caused by differences in linear expansion coefficients, leading to gaps and reduced reliability.
Innovation Solution
An electronic component module design featuring a heat dissipating member with a main body and auxiliary portions, where the auxiliary portions are tilted inward to reduce contraction and prevent separation from the sealing resin, ensuring a stable adhesive surface and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation plate is used to dissipate heat from the IC, then heat dissipation efficiency is improved, but the heat dissipation plate and sealing resin separate due to different linear expansion coefficients, generating gaps and reducing reliability
Solution Approach 1:
The invention changes the geometric parameters of the heat dissipation plate by adding a curved portion that extends downward toward the substrate. This structural parameter change allows the heat dissipation plate to accommodate differential thermal expansion between the metal plate and resin sealing material, preventing separation and maintaining bonding reliability while preserving heat dissipation efficiency.
Solution Approach 2:
The invention introduces a vertical dimension to the heat dissipation plate structure by curving a portion downward toward the substrate. This three-dimensional configuration allows the plate to compensate for thermal expansion differences in the horizontal plane, preventing gap formation at the interface between the heat dissipation plate and sealing resin.
2Reliability
If the heat dissipation plate is bonded to the substrate to prevent separation, then reliability is improved, but the structure becomes more complex and manufacturing difficulty increases
Solution Approach 1:
The invention merges the heat dissipation function with the bonding function into a single integrated structure. The curved portion of the heat dissipation plate simultaneously provides thermal conduction path and mechanical bonding to the substrate, eliminating the need for separate bonding structures or additional manufacturing steps.
Solution Approach 2:
The heat dissipation plate is designed to perform multiple functions: heat conduction from the IC, structural support, and bonding to the substrate through the curved portion. This multi-functional design simplifies the overall structure and reduces manufacturing complexity while improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces or prevents gaps between the heat dissipation plate and sealing resin, enhancing the reliability and heat dissipation efficiency of the electronic component module.
Implementation Method 1
a heat dissipating member (40), and a first sealing resin (50). The heat dissipating member (40) includes a main body portion (41) and an auxiliary portion (42). The main body portion (41) is disposed opposite to the substrate (20) with respect to the first electronic component (31)
Implementation Method 2
contraction of the main body portion is significantly reduced or prevented by the auxiliary portion. As a result, separation of an adhesive surface between the heat dissipating member and the first sealing resin is significantly reduced or prevented
Data Source
AI summary
An electronic component module is provided that includes a substrate, an electronic component, a heat dissipating member, and a sealing resin. The electronic component is mounted on the substrate. The heat dissipating member includes a flat plate and columnar bodies. The sealing resin covers a side of a first main surface of the substrate and the electronic component. Moreover, the heat dissipating member, except for a top surface of the flat plate, is covered with the sealing resin. The columnar bodies are disposed at an outer peripheral of the flat plate, and have a shape protruding from a bottom surface of the flat plate. The columnar bodies include a root connected to the flat plate, and a tip connected to the substrate. In a plan view of the electronic component module, the tip is not outside the root.