Heat Dissipation Module With Uneven Conduction Surface for Compact Chips

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Solution Overview

Problem

Existing heat dissipation structures in electronic components fail to effectively transfer heat energy due to tight component arrangements, leading to temperature rise, reliability issues, and potential electrical leakage, especially with high-performance CPUs and GPUs.

Innovation Solution

A heat dissipation module comprising a heat dissipating sheet with a heat conduction member featuring an uneven surface, such as projections or recesses, to enhance heat transfer and stability, accompanied by a heat dissipating assembly for improved heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional heat sink structure is used, then the device structure is simple, but the heat dissipation effectiveness is insufficient due to tight component arrangements

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidheat dissipation structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat dissipation structure is divided into multiple independent heat conduction members (first heat conduction member, second heat conduction member, third heat conduction member) that can be separately positioned and adjusted. Each member has specific projection structures that segment the heat transfer paths, allowing independent optimization of heat dissipation at different locations without requiring complete redesign of the entire structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different heat conduction members are designed with different projection structures tailored to specific heat generating sources. The first heat conduction member has projections matching the CPU heat distribution, while the second and third members have projections for GPU heat spots. This local customization optimizes heat dissipation effectiveness at each specific location rather than using a uniform structure throughout.

Inventive Principle:

Principle #3Local quality

2Volume of moving object

If the component arrangement is tightened for miniaturization, then the device size is reduced, but the heat energy transfer to outside becomes ineffective

Engineering Contradiction:

Improvedevice sizeVSAvoidinternal temperature

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The heat conduction members with their projection structures are nested within the limited space of the device, fitting into the tight component arrangements. The projections are designed to contact heat generating sources directly while the overall structure remains compact, allowing effective heat dissipation without increasing device volume.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Productivity

If high-performance CPU/GPU is used for increased performance, then the operation performance is improved, but the heat energy generated increases causing temperature rise

Engineering Contradiction:

Improveoperation performanceVSAvoidheat energy

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The invention changes the physical parameters of the heat dissipation system by introducing heat conduction members with specific projection structures that have optimized thermal contact areas. This allows more efficient heat transfer from high-performance components without changing the components themselves, effectively managing the increased heat energy generated by high-performance CPU/GPU operation.

Inventive Principle:

Principle #35Parameter changes

4Volume of moving object

If the heat generating source locations are uneven, then the device can be compact, but the heat dissipation becomes unstable

Engineering Contradiction:

Improvedevice compactnessVSAvoidheat dissipation stability

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

Each heat conduction member is designed with projection structures specifically matched to the heat distribution characteristics of different heat generating sources. The first member handles CPU heat with its specific projection pattern, while the second and third members handle GPU heat spots with their own projection configurations. This local customization ensures stable heat dissipation despite uneven heat source locations.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module prevents underclocking and breakage of high-power chips by stabilizing heat dissipation, reducing temperature fluctuations, and enhancing reliability.

Implementation Method 1

a heat conduction member (2) disposed on the first surface (11) of the heat dissipating sheet (1)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The second surface (12) of the heat dissipating sheet (1) is configured to be arranged adjacent to a periphery of a heat generating source (3)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12526964B2Heat dissipation module

Publication Date: 2026.01.13 CLEVO

AI summary

A heat dissipation module is provided. The heat dissipation module includes a heat dissipating sheet and a heat conduction member. The heat dissipating sheet has a first surface and a second surface. The heat conduction member is disposed on the first surface of the heat dissipating sheet, and the second surface of the heat dissipating sheet is configured to be arranged adjacent to a periphery of a heating source. At least a part of a surface of the heat conduction member that is adjacent to the first surface has an uneven surface.