Heat Pad Dissipates GIP Driver Heat in Flexible OLED Displays
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Solution Overview
Problem
Large-sized thin film transistors in gate-in-panel drivers of OLED displays generate high heat, which can damage the organic layer and lead to defective operation due to heat transfer, causing gas generation and layer peeling.
Innovation Solution
A heat pad is disposed between the flexible substrate and a protective member, overlapping the large-sized thin film transistor portion, and is grounded through a conductive member to dissipate heat effectively, preventing damage to the GIP driver.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the size of thin film transistor is increased to enhance driving capability, then the driving power is improved, but heat generation increases causing damage to organic layer
Solution Approach 1:
The patent extracts the heat dissipation function from the main transistor structure by introducing a separate heat pad component. This heat pad is positioned adjacent to the large-sized thin film transistor to specifically handle heat removal, allowing the transistor to maintain its large size for driving power while the heat pad manages the thermal byproduct independently.
Solution Approach 2:
The heat pad acts as an intermediary component between the large-sized thin film transistor and the organic layer. It intercepts heat generated by the transistor before it can transfer to and damage the organic layer, thus protecting the organic layer while allowing the transistor to operate at high power levels.
2Power
If heat is not dissipated effectively, then the thin film transistor can operate at high power, but gas is generated in the organic layer causing layer peeling
Solution Approach 1:
The patent converts the harmful heat byproduct of high-power transistor operation into a manageable thermal flow by directing it to the heat pad. The heat pad absorbs and dissipates this heat, preventing it from causing gas generation and layer peeling in the organic layer, thus transforming a potential failure mode into a controlled thermal management process.
Solution Approach 2:
The heat pad serves as a protective intermediary between the high-power transistor and the organic layer. It intercepts thermal energy that would otherwise cause damage, maintaining layer integrity while allowing the transistor to operate at high power levels without compromising reliability.
3Temperature
If a heat pad is added to dissipate heat, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat pad is implemented as a thin film structure that can be integrated into the existing device architecture. This thin film approach provides effective heat dissipation while minimizing the increase in device complexity and maintaining a compact form factor.
Solution Approach 2:
The heat pad is designed to perform multiple functions: heat dissipation, electrical grounding, and structural support. By combining these functions into a single component, the patent reduces the overall device complexity compared to having separate components for each function.
4Object-affected harmful factors
If the heat pad is electrically connected to ground, then electrical interference is reduced, but manufacturing complexity increases
Solution Approach 1:
The heat pad is merged with the grounding system by making it electrically connected to ground. This combination allows the heat pad to simultaneously perform heat dissipation and electrical shielding functions, reducing electrical interference without requiring a completely separate grounding structure.
Solution Approach 2:
The heat pad is designed as a multi-functional component that combines thermal management and electrical grounding. This universal design reduces manufacturing complexity by eliminating the need for separate heat dissipation and grounding structures, while still providing both functions effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat pad efficiently dissipates heat generated by the large-sized thin film transistors, preventing damage to the GIP driver and ensuring proper operation by reducing temperature and minimizing electrical interference.
Implementation Method 1
a heat pad disposed between the flexible substrate and the protective member and overlapping the GIP driver... efficiently dissipates heat generated by the large-sized thin film transistors
Implementation Method 2
the heat pad is grounded to the metal protective member through a conductive member... minimizing electrical interference
Data Source
AI summary
A display device and a method for manufacturing the same capable of preventing a defective drive of a gate-in-panel (GIP) driver by dissipating high heat generated in a large-sized thin film transistor of the GIP driver are disclosed. The display device includes a flexible substrate, a GIP driver and a display unit disposed on the flexible substrate, a protective member disposed under the flexible substrate, and a heat pad disposed between the flexible substrate and the protective member and overlapping the GIP driver.