Heat Dissipation Panel with Inclined Liquid Return Paths
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material restrictions, and increased product size, and are limited by the use of expensive materials and refrigerants that pose environmental concerns.
Innovation Solution
An active heat dissipation apparatus with a refrigerant flow space formed by bending or joining metal panel members, featuring separate refrigerant flow paths and strength reinforcement portions, allowing for improved heat dissipation performance and the use of water as a refrigerant, while minimizing thermal concentration and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy materials are used for heat dissipation fins, then thermal conductivity is improved, but material cost increases and environmental restrictions apply
Solution Approach 1:
The patent changes the physical-chemical parameters of the refrigerant system by using water instead of traditional refrigerants, and adjusting the phase change temperature characteristics to optimize heat dissipation performance while reducing material costs and environmental impact
Solution Approach 2:
The patent utilizes phase transition of water (liquid-gas transition) within the heat dissipation apparatus to transfer heat efficiently, replacing the need for expensive aluminum alloys while maintaining or improving thermal management performance
2Productivity
If the number of heat generation elements increases for MIMO technology, then data transmission capacity is improved, but heat dissipation complexity and difficulty increase
Solution Approach 1:
The patent merges multiple heat dissipation functions into a single integrated water-based phase change system, where one apparatus handles heat from multiple heat generation elements simultaneously, reducing overall system complexity
Solution Approach 2:
The water-based heat dissipation apparatus serves multiple functions: it cools multiple heat generation elements, provides phase change heat transfer, and acts as a universal thermal management solution for various components within the antenna device
3Temperature
If traditional refrigerants are used in heat dissipation systems, then heat dissipation performance is improved, but environmental harm increases
Solution Approach 1:
The patent converts the typically harmful traditional refrigerants into a beneficial water-based system, where water's phase change properties are harnessed for efficient heat dissipation without environmental harm, turning a potential pollutant into a green cooling solution
Solution Approach 2:
The patent creates an environmentally inert heat dissipation system using water, which does not deplete ozone or contribute to greenhouse effects, replacing harmful refrigerants with a benign substance that maintains thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances heat dissipation performance, reduces manufacturing costs, and complies with environmental regulations by using water as a refrigerant, achieving comparable results to traditional systems while avoiding the use of restricted materials.
Implementation Method 1
a first refrigerant flow path (210) positioned to be adjacent to a press-fitting portion (150) provided on a rear surface portion of a heat dissipation housing main body (110) that is a heat dissipation target and having a vaporization zone (210) in which the refrigerant is changed in phase from a liquid phase to a gaseous phase
Implementation Method 2
a plurality of second refrigerant flow paths (220) provided in a condensation zone (205) provided in a portion other than the first refrigerant flow path (210) and configured to guide a flow of a liquid refrigerant to the vaporization zone (210)
Data Source
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AI summary
The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of a liquid refrigerant to the vaporization zone, and in which the second refrigerant flow paths form independent flow paths for the liquid refrigerant by a plurality of inclined guides, which protrude in the refrigerant flow space, have surfaces that adjoin one another and are in surface contact with one another, and are provided straight and inclined toward the first refrigerant flow path so as to be physically separated from the adjacent second refrigerant flow path, and by a plurality of strength reinforcement portions respectively formed on the plurality of inclined guides, thereby significantly improving heat dissipation performance.