Heat Dissipation Panel with Separated Refrigerant Return Paths
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material restrictions, and increased product size, and are challenged by the need for more efficient refrigerant use and compliance with environmental regulations.
Innovation Solution
An active heat dissipation apparatus with a refrigerant flow space formed by bending or joining metal panel members, featuring separate refrigerant flow paths and strength reinforcement portions, allowing for improved heat transfer and use of water as a refrigerant, while minimizing thermal concentration and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy materials are used for heat dissipation fins, then thermal conductivity is improved, but material restrictions and environmental compliance issues arise
Solution Approach 1:
The patent changes the material parameter from aluminum alloy to stainless steel, and changes the heat dissipation mechanism parameter from pure thermal conduction to phase change heat transfer. This allows the use of environmentally compliant materials while achieving superior heat dissipation performance through refrigerant phase change.
Solution Approach 2:
The patent introduces a phase change heat dissipation mechanism using refrigerant that transitions between liquid and vapor phases. The refrigerant absorbs heat during vaporization and releases heat during condensation, enabling effective heat dissipation without relying on high thermal conductivity materials like aluminum alloy.
2Temperature
If thermal conduction materials are used, then heat transfer is improved, but product size increases
Solution Approach 1:
The patent utilizes phase change heat dissipation where refrigerant absorbs large amounts of heat during vaporization and releases heat during condensation. This phase change mechanism achieves superior heat transfer efficiency in a compact form factor, avoiding the need for thick thermal conduction materials.
Solution Approach 2:
The patent changes the heat transfer mechanism from thermal conduction to phase change heat transfer, which has much higher heat transfer coefficients. This allows for a thinner, more compact heat dissipation apparatus while achieving better heat transfer performance.
3Ease of manufacture
If conventional heat dissipation structures are used, then manufacturing is simplified, but heat dissipation performance is insufficient
Solution Approach 1:
The patent introduces a phase change heat dissipation mechanism using refrigerant that transitions between liquid and vapor phases. Despite this added complexity, the overall structure remains relatively simple with a sealed cavity containing the refrigerant, achieving superior heat dissipation performance.
Solution Approach 2:
The patent combines stainless steel material with phase change refrigerant to create a composite heat dissipation system. This combination achieves high heat dissipation performance while maintaining ease of manufacture through integrated construction of the heat dissipation apparatus.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance, reduces manufacturing costs, and complies with environmental regulations by utilizing water as a refrigerant, achieving superior heat transport and reducing product thickness.
Implementation Method 1
capable of improving heat dissipation performance by actively transferring heat, which is generated from a heat generation device (e.g., an electronic device), by means of a phase change of a refrigerant
Implementation Method 2
actively transferring heat, which is generated from a heat generation device
Implementation Method 3
thermal conduction material of the active heat dissipation apparatus
Data Source
AI summary
The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of a liquid refrigerant to the vaporization zone, and in which the second refrigerant flow paths form independent flow paths for the liquid refrigerant by a plurality of inclined guides, which protrude in the refrigerant flow space, have surfaces that adjoin one another and are in surface contact with one another, and are provided straight and inclined toward the first refrigerant flow path so as to be physically separated from the adjacent second refrigerant flow path, and by a plurality of strength reinforcement portions respectively formed on the plurality of inclined guides, thereby significantly improving heat dissipation performance.