Heat-Peelable Substrate Bonding for Damage-Free Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The use of wax as a fixing material for hard and brittle substrates during processing leads to defects such as breakage during separation due to excessive loading, particularly after thinning processes like grinding/polishing.
Innovation Solution
A method involving the use of a heat-peelable layer, such as a pressure-sensitive adhesive tape, between the substrate and the support, which loses adhesive strength upon heating, allowing for damage-free separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If wax is used as a fixing material for hard and brittle substrates during processing, then the substrate can be fixed onto the support, but the substrate is liable to breakage during separation due to excessive loading
Solution Approach 1:
The patent changes the physical-chemical parameters of the fixing material by using a two-layer adhesive system instead of single-phase wax. The first adhesive layer provides strong initial bonding, while the second layer enables controlled release through solvent interaction, transforming the separation mechanism from force-based to chemistry-based
Solution Approach 2:
The patent introduces a second adhesive layer as an intermediary substance between the substrate and the first adhesive layer. This intermediary layer acts as a release agent that mediates the separation process by being selectively removed with solvent, allowing clean detachment without direct mechanical stress on the substrate
2Ease of operation
If heating is applied to melt wax for separation, then the substrate can be separated from the support, but excessive loading occurs during movement causing damage
Solution Approach 1:
The patent replaces the mechanical heating-and-pulling separation system with a chemical dissolution-based separation system. Instead of applying thermal energy to melt wax and then mechanically separating the substrate, the invention uses solvent interaction to chemically modify the adhesive layers, enabling separation through controlled adhesion loss rather than mechanical force
3Manufacturing precision
If the substrate is thinned by grinding/polishing, then the substrate becomes more precise, but it becomes more susceptible to damage during separation
Solution Approach 1:
The patent applies beforehand cushioning by designing an adhesive system that anticipates the vulnerability of thinned substrates. The two-layer adhesive structure with selective release capability is prepared in advance to provide controlled, low-stress separation, cushioning the thinned substrate from the high mechanical loads that would otherwise cause damage during detachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage to the substrate during separation by reducing unneeded loading, simplifying the separation process, and minimizing risks of peeling and handling damage.
Implementation Method 1
separating the workpiece from the support by heating the heat-peelable layer after the processing
Implementation Method 2
the fixing the workpiece includes arranging the pressure-sensitive adhesive tape between the heat-peelable layer and the workpiece
Data Source
Figure 1(a)~1(c)
Figure 2(a-1)~3
Figure 4~5
AI summary
Provided is a method of manufacturing an electronic part including fixing a hard and brittle substrate to a support and separating the hard and brittle substrate from the support, the method being capable of preventing the hard and brittle substrate from being damaged during the separation of the hard and brittle substrate from the support. The method of manufacturing an electronic part of the present invention is a method of manufacturing an electronic part including processing a workpiece fixed onto a support, the method including: fixing the workpiece by arranging at least one heat-peelable layer between the support and the workpiece; processing a surface of the fixed workpiece on an opposite side to the heat-peelable layer; and separating the workpiece from the support by heating the heat-peelable layer after the processing.