Heat Pipe Cooling Structure for AI Acceleration Card Heat Dissipation
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Solution Overview
Problem
Traditional heat dissipation devices for acceleration cards, particularly those used in artificial intelligence applications, are inadequate in effectively managing the increased heat generated due to higher computing power demands.
Innovation Solution
A heat dissipation device comprising a base with through-pipe grooves, heat pipes with extended heat transfer sections, and a heat dissipation structure, along with a turbo fan, which enhances heat transfer and dissipation by increasing contact area and utilizing airflow to accelerate heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation devices are used for acceleration cards, then the device structure is simple, but the heat dissipation effect is poor
Solution Approach 1:
The heat dissipation device is segmented into multiple functional components: base with through-pipe grooves, heat pipes with heat absorption sections and heat transfer sections, and heat dissipation structures. This segmentation allows each component to perform its specific function optimally, improving overall heat dissipation effect while maintaining reasonable structural complexity
Solution Approach 2:
The heat transfer sections of the heat pipes extend in the perpendicular direction away from the support plate, utilizing the third dimension (vertical direction) to increase heat transfer area and improve heat dissipation efficiency without significantly increasing the horizontal footprint of the device
2Productivity
If computing power is increased for AI algorithms, then data processing speed is improved, but heat generation increases
Solution Approach 1:
The invention converts the harmful heat generated by high-power computing into a manageable thermal flow by directing it through the heat pipes and heat dissipation structures. The heat that would otherwise be waste is systematically transported and dissipated, allowing sustained high computing power without thermal damage
Solution Approach 2:
The heat pipes utilize phase transition (evaporation and condensation of working fluid) to efficiently transfer heat from the heat absorption sections to the heat transfer sections, converting thermal energy into phase change energy and back, thereby effectively managing the heat generated by high-performance computing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat faster and more efficiently, addressing the limitations of traditional devices by enlarging contact areas and leveraging airflow to improve heat transfer and dissipation performance.
Implementation Method 1
a plurality of heat pipes, each of the heat pipes including a heat absorption section and a heat transfer section connected to the heat absorption section
Implementation Method 2
the heat transfer section of at least one heat pipe is away from the support plate in the perpendicular direction to the support plate
Implementation Method 3
a heat dissipation structure arranged on the first surface, where the heat transfer sections of the plurality of heat pipes extend into the interior of the heat dissipation structure and contacts the heat dissipation structure
Data Source
AI summary
Disclosed is a heat dissipation device including a base, a plurality of heat pipes and a heat dissipation structure. The base includes a support plate, a plurality of through-pipe grooves are arranged in the support plate. Each heat pipe includes a heat absorption section and a heat transfer section connected to the heat absorption section, where the heat absorption section is arranged in the through-pipe grooves and at least one heat transfer section of the heat pipe is away from the support plate in the perpendicular direction to the support plate. The heat dissipation structure is arranged on the first surface of the support plate, and the heat transfer section of the plurality of heat pipes extends into the interior of the heat dissipation structure and thermally contacts the heat dissipation structure. The heat dissipation device of the present disclosure dissipates heat faster.