Heat Pipe Cooling for Aircraft Power Electronics Without Condensation
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Solution Overview
Problem
Existing cooling systems for aircraft struggle to efficiently cool heat-generating devices like power electronics due to limited space and small temperature differences, leading to overheating and potential short-circuits or electric arcs when using cold plates with low-temperature refrigerants.
Innovation Solution
A cooling unit incorporating a heat exchanger and a heat pipe that absorbs heat from power electronics by evaporating a working agent in the liquid phase and releases heat to a cooling agent in the gas phase, maintaining the power electronics above the dew point and allowing for higher power operation without overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cold plates with low-temperature refrigerants are used to cool power electronics, then cooling efficiency is improved, but the risk of condensation and electrical short-circuits increases
Solution Approach 1:
The patent introduces a heat pipe as an intermediary thermal management component between the power electronics and the cooling system. The heat pipe absorbs heat from the power electronics through its evaporator section and transfers it to the condenser section, which is thermally coupled to the cooling agent. This indirect cooling approach prevents the power electronics from being directly exposed to low-temperature refrigerants, thereby eliminating condensation risks while maintaining effective heat dissipation.
Solution Approach 2:
The patent changes the thermal parameters of the cooling system by using a heat pipe with specific evaporator and condenser sections. The heat pipe creates a temperature gradient along its length, with the evaporator section at higher temperature (in contact with power electronics) and the condenser section at lower temperature (in contact with cooling agent). This parameter transformation allows efficient heat transfer while keeping the power electronics above the dew point.
2Temperature
If space for heat dissipation is increased, then cooling performance is improved, but device compactness deteriorates
Solution Approach 1:
The patent utilizes phase transitions of the working agent within the heat pipe to achieve high heat dissipation performance in a compact form. The working agent evaporates in the evaporator section (absorbing heat from power electronics) and condenses in the condenser section (releasing heat to the cooling agent). This phase change mechanism enables highly efficient heat transfer within a small volume, resolving the contradiction between cooling performance and device compactness.
3Power
If power electronics operate at higher power levels, then functionality is improved, but heat generation increases leading to overheating
Solution Approach 1:
The heat pipe serves as a thermal intermediary that enables power electronics to operate at higher power levels by efficiently managing the generated heat. The evaporator section of the heat pipe is thermally coupled to the power electronics, providing a dedicated heat dissipation path that scales with power output, thus preventing overheating while maintaining high operational power capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact and reliable cooling method for heat-generating devices, preventing overheating and electrical issues while maintaining high power operation by effectively dissipating heat through a heat pipe, ensuring the power electronics remain above the dew point.
Implementation Method 1
a heat pipe that absorbs heat from power electronics by evaporating a working agent in the liquid phase
Implementation Method 2
a heat pipe that absorbs heat from power electronics by evaporating a working agent in the liquid phase and releases heat to a cooling agent
Implementation Method 3
a heat exchanger and a heat pipe that absorbs heat from power electronics
Data Source
AI summary
A cooling unit in a transport unit includes power electronics; a heat exchanger for thermally coupling a cooling agent of a central cooling system of the transport unit with air of the cooling unit to cool one or more generating devices; and a heat pipe for heat dissipation of the power electronics. At a first portion of the heat pipe, at least some of a working agent is in the liquid phase and, at a second portion of the heat pipe, at least some of the working agent is in the gas phase. In the first portion of the heat pipe, heat from the power electronics is absorbed by evaporating the working agent in the liquid phase. In the second portion of the heat pipe, heat is released to the cooling agent by condensing the working agent in the gas phase.