Heat Pipe Base Plate Gap Closing for EMI Suppression
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Solution Overview
Problem
The increasing heat generation from advanced integrated circuits in electronic devices poses challenges for effective cooling, as traditional heat sink and cooling fan configurations struggle to manage the increased thermal load without increasing the device's size or complexity.
Innovation Solution
The proposed electronic apparatus incorporates a heat radiating device with a circuit board, a board shield, and a heat radiating device featuring a base plate that supports fins and a heat pipe, which effectively directs airflow and suppresses electromagnetic interference, allowing for improved heat dissipation and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink is increased in size to deal with increased heat from integrated circuits, then heat dissipation capability is improved, but device size increases
Solution Approach 1:
The heat pipe is nested within the board shield structure, with its extending portion passing through the shield. This allows the heat pipe to be integrated into the existing device architecture rather than adding a separate external heat sink, thereby improving heat dissipation without proportionally increasing device size
Solution Approach 2:
The heat pipe extends in a first direction along the circuit board and connects to a heat radiating device in a second direction perpendicular to the board shield. This three-dimensional arrangement allows efficient heat transfer while maintaining a compact footprint
2Temperature
If a heat pipe is added to spread heat to the whole of the heat sink, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The board shield serves multiple functions: it provides electromagnetic shielding, structural support, and acts as a mounting structure for the heat pipe. The heat pipe simultaneously conducts heat from the circuit board and extends to the heat radiating device, reducing the need for separate components
Solution Approach 2:
The heat pipe is integrated with the board shield structure, combining the shielding function and heat conduction function into a unified design. The base plate is also integrated to support both the heat pipe and the heat radiating device fins
3Area of stationary object
If the cooling fan and heat sink are arranged on the lower side of the circuit board, then space utilization is improved, but electromagnetic wave leakage occurs at gaps
Solution Approach 1:
The gap-closing function is extracted from the board shield structure and assigned to a dedicated closing portion on the base plate. This separate component specifically addresses electromagnetic leakage without interfering with the compact arrangement of cooling components
Solution Approach 2:
The closing portion is specifically positioned at the gap between the heat radiating device and the board shield where electromagnetic leakage occurs. This localized solution addresses the specific problem area without requiring changes to the overall compact design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency while minimizing the device's size and preventing electromagnetic interference, effectively cooling high-heat components like CPUs and GPUs.
Implementation Method 1
a heat pipe that includes a connecting portion being located between the plurality of fins and the circuit board and extending in a first direction along the circuit board
Data Source
AI summary
A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).