Heat Pipe Vapor Chamber Interface With Continuous Capillary Contact
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Solution Overview
Problem
The insertion of a heat pipe into a vapor chamber hinders heat transfer due to reduced internal communication area and resistance, especially at the point of contact, compromising the continuity of capillary structures.
Innovation Solution
A capillary structure is added to the top plate of the vapor chamber, allowing direct contact between the heat pipe and the vapor chamber's capillary structure, maintaining continuity and enhancing bonding strength without interrupting heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the open end of the heat pipe is inserted into the vapor chamber and abutted against the bottom plate, then the bonding between heat pipe and vapor chamber is improved, but the internal communication area between heat pipe and vapor chamber is reduced
Solution Approach 1:
The patent changes the spatial arrangement from vertical insertion (through bottom plate) to horizontal integration (through top plate). The heat pipe is positioned at the side of the vapor chamber with its open end inserted through the top plate, transforming the bonding interface from a bottom-plate contact to a side-wall integration, thereby preserving the central communication pathway.
Solution Approach 2:
The patent introduces a capillary structure in the top plate as an intermediary element that facilitates both bonding and heat transfer. This capillary structure serves as a mediator that connects the heat pipe to the vapor chamber interior without requiring direct abutment against the bottom plate, enabling continuous capillary action while maintaining structural integrity.
2Reliability
If the open end of the heat pipe is inserted into the vapor chamber, then continuous capillary action is achieved, but resistance to heat transfer is increased
Solution Approach 1:
The capillary structure in the top plate acts as an intermediary that enables continuous capillary action between the heat pipe and vapor chamber. This intermediary structure provides a dedicated capillary pathway that maintains reliability of capillary transport while minimizing resistance by creating a direct, unobstructed route for working fluid circulation.
Solution Approach 2:
The patent applies capillary structures locally at specific positions in the top plate where heat pipes are integrated, rather than requiring universal insertion of heat pipe ends into the vapor chamber. This localized approach maintains capillary continuity at critical interfaces while preserving the overall internal communication area for heat transfer.
3Strength
If an opening is added for heat pipe insertion, then bonding is improved, but the internal communication area is effectively reduced
Solution Approach 1:
The patent relocates the opening and heat pipe integration from the bottom plate to the top plate, changing the dimensional position of the bonding interface. This allows the heat pipe to be inserted through the top plate and bond to the side wall, preserving the bottom plate's full area for heat transfer and vapor circulation.
Solution Approach 2:
The patent segments the vapor chamber structure by separating the bonding function (achieved through top plate integration) from the heat transfer function (maintained through preserved bottom plate and central communication area). This segmentation allows independent optimization of bonding strength without compromising internal communication area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures continuous capillary transmission and improved bonding between the heat pipe and vapor chamber, enhancing heat transfer efficiency.
Implementation Method 1
allowing the capillary structures inside the heat pipe to make contact with the capillary structures inside the vapor chamber to provide a continuous capillary action
Implementation Method 2
improves the bonding between the heat pipe and the vapor chamber
Implementation Method 3
Heat pipe includes a pipe body, and a pipe capillary layer disposed in the pipe body
Data Source
AI summary
A heat dissipation device includes a vapor chamber (1) and at least one heat pipe (2). The vapor chamber (1) includes a bottom plate (10) and a top plate (11) combined with each other to form a cavity (100); the cavity (100) contains a top plate capillary layer (11a) covering the top plate (11) which has at least one through hole (110). The heat pipe (2) includes a pipe body (20) with a closed end (200) and an open end (201) fixed in the through hole (110), and a pipe capillary layer (21) with a connecting portion (210). The top plate (11) includes at least one protrusion (111) corresponding to the through hole (110) and having a receiving portion (111a) recessed inside the top plate (11), and a capillary structure (11b) in the receiving portion (111a) and contacting with the connecting portion (210) and top plate capillary layer (11a).