Heat Pipe Condensation End Immersion in Liquid Cooler
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Solution Overview
Problem
Existing heat dissipation structures for electronic devices face inefficiencies due to poor contact between heat pipes and coolers, leading to inadequate heat dissipation and potential damage from rigid body collisions.
Innovation Solution
A heat dissipation structure that includes a heat pipe with a condensation end inserted into a chamber within a cooler, where the cooler has a shell, inner shell, and cooling fluid, allowing direct heat exchange between the condensation end and the cooling fluid, while protection gaskets and one-way valves ensure secure insertion and prevent fluid leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the condensation end of the heat pipe is engaged in a groove in the cooler using solid-solid contact, then heat conduction effect is achieved, but the condensation end and the cooler must be made of materials having high thermal conductivity which combines them in a rigid body, causing interference and collision damage when the mating gap is too small
Solution Approach 1:
The patent introduces a cooling fluid as an intermediary medium between the condensation end and the cooler. Instead of direct solid-solid contact, the cooling fluid fills the gap and enables heat transfer through fluid convection and conduction, eliminating the rigid body connection that causes collision damage while maintaining effective heat conduction.
Solution Approach 2:
The patent changes the thermal contact parameter from solid-solid interface contact to fluid-filled gap contact. By allowing a controlled gap to be filled with cooling fluid, the system transforms the heat transfer mechanism from direct conduction through rigid contact to conduction and convection through the fluid medium, resolving the collision issue.
2Object-affected harmful factors
If the mating gap between the condensation end and the cooler is made large, then collision damage is avoided, but the heat dissipation effect becomes poor due to incomplete contact
Solution Approach 1:
The cooling fluid serves as a mediator that bridges the gap between the condensation end and the cooler. Even when the gap is large enough to avoid collision, the cooling fluid fills the space and maintains effective heat transfer through its thermal conduction and convection properties, eliminating the need for tight mechanical contact.
Solution Approach 2:
The patent applies hydraulic principles by using a liquid cooling fluid to fill the gap and transfer heat. The fluid's ability to flow and conform to the gap geometry ensures continuous thermal contact without requiring precise mechanical fit, thereby avoiding collision while maintaining heat dissipation efficiency.
3Productivity
If the power of the air supply device is improved to enhance air exhaust rate, then heat dissipation is improved, but the system load is relatively increased
Solution Approach 1:
The patent replaces the mechanical air-based heat dissipation system with a liquid-based heat pipe system. Instead of using high-power air supply devices that consume significant energy, the system uses phase change and thermal conduction in the heat pipe combined with liquid cooling, achieving superior heat dissipation with minimal energy consumption.
Solution Approach 2:
The heat pipe utilizes phase transitions (evaporation at the evaporation end and condensation at the condensation end) to transfer heat efficiently. This phase change mechanism provides high heat transfer coefficients without requiring external power input, replacing the energy-intensive forced air convection system.
4Productivity
If the circuit integration degree is increased to improve operation efficiency, then more electronic elements are added, but the space becomes congested causing excessive accumulation of heat energy
Solution Approach 1:
The patent employs liquid cooling through the heat pipe and cooling fluid system to manage the increased heat density resulting from higher circuit integration. The liquid medium provides superior heat capacity and thermal conductivity compared to air, effectively removing heat from congested electronic components without requiring additional space.
Solution Approach 2:
The heat pipe's phase change mechanism (liquid-vapor transition) provides extremely efficient heat transfer that can handle the high heat flux generated by densely packed electronic elements. The latent heat of vaporization and condensation enables rapid heat removal from small areas, addressing the thermal management challenges of high integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency by ensuring complete immersion of the condensation end in the cooling fluid, preventing damage from collisions and leakage, and maintaining effective heat transfer even with mating tolerance, thus overcoming the limitations of prior art.
Implementation Method 1
the evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end
Implementation Method 2
the cooling fluid dissipates the heat energy of the condensation end
Implementation Method 3
heat conduction effect is achieved between the condensation end and the cooler
Data Source
AI summary
A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.