Heat Pipe With Integrated Coolant Channels
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Solution Overview
Problem
Current cooling technologies are inadequate for efficiently dissipating high heat fluxes in high-tech devices such as semiconductors, IT hardware, and nuclear fusion reactors, which limits their operating performance and longevity.
Innovation Solution
A 3-D printed heat pipe array is designed with an elongate envelope containing evaporator, condenser, and adiabatic sections, along with integrated coolant channels and a porous wicking structure to enhance capillary and boiling limits, allowing for efficient heat transfer and management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cooling technologies are used, then device simplicity is maintained, but heat dissipation efficiency is insufficient for high heat fluxes
Solution Approach 1:
The heat pipe is divided into distinct functional sections: evaporator section with porous wick for liquid transport, adiabatic section for vapor rise, and condenser section for heat release. This segmentation allows each section to be optimized for its specific function, achieving high heat dissipation efficiency while maintaining manageable complexity through modular design
Solution Approach 2:
A porous wick material is incorporated in the evaporator section to enable capillary action for liquid working fluid transport. The porous structure provides large surface area for evaporation and efficient liquid distribution, dramatically improving heat dissipation capability without requiring complex external pumping systems
Solution Approach 3:
The heat pipe utilizes phase transition of the working fluid (liquid to vapor in evaporator, vapor to liquid in condenser) as the core heat transfer mechanism. This phase change process enables high heat flux dissipation with minimal temperature difference, achieving superior cooling performance compared to conventional conduction-based cooling
2Productivity
If advanced cooling technologies are implemented, then heat dissipation performance improves, but manufacturing complexity increases
Solution Approach 1:
Multiple functions are merged into a single integrated heat pipe structure: the envelope contains the working fluid, the porous wick provides liquid transport, and the segmented sections perform evaporation, vapor transport, and condensation. This consolidation achieves advanced heat dissipation performance while simplifying manufacturing by eliminating the need for separate components and assembly steps
Solution Approach 2:
The invention optimizes parameters such as porous wick porosity, channel dimensions, and section lengths to achieve high heat flux dissipation. By carefully selecting and adjusting these parameters during manufacturing, advanced cooling performance is achieved through straightforward fabrication processes without requiring complex manufacturing techniques
3Reliability
If heat pipe structures are used, then heat transfer efficiency is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Different sections of the heat pipe are designed with locally optimized properties: the evaporator section has porous wick structure for liquid distribution, the adiabatic section has smooth walls for vapor flow, and the condenser section has optimized surface area for heat release. This local quality approach ensures high heat transfer efficiency in each section while maintaining overall structural simplicity
Solution Approach 2:
The heat pipe is designed as a self-contained system where the working fluid automatically circulates through phase change and capillary action without external control systems. The porous wick self-regulates liquid flow based on capillary pressure, and the phase transition process self-adjusts to heat input conditions, achieving reliable high-efficiency heat transfer with minimal structural complexity and no active control components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat pipe array effectively transforms high heat fluxes into manageable levels, enabling reliable and efficient cooling of high-tech devices, including nuclear fusion reactors, by integrating advanced materials and manufacturing techniques.
Implementation Method 1
Heat pipes rely on two phase cooling and capillary flow inside a closed envelope
Implementation Method 2
the working fluid in vapor and liquid states, respectively, flows along the vapor passage and the liquid channel
Implementation Method 3
a condenser section... providing for fluid communication of an evaporated working fluid from the evaporator section to the condenser section
Implementation Method 4
Heat pipes rely on two phase cooling and capillary flow inside a closed envelope... at least one second channel providing wicking means effective for transferring a condensed working fluid from the condenser section to the evaporator section
Data Source
Figure 1~2
Figure 3
AI summary
The present invention provides a heat pipe comprising: a. an elongate envelope encasing at or towards its first end an evaporator section, at or towards its second end a condenser section, and an adiabatic section intermediate the evaporator and condenser sections; b. at least one first channel providing for fluid communication of an evaporated working fluid from the evaporator section to the condenser section; c. at least one second channel providing wicking means effective for transferring a condensed working fluid from the condenser section to the evaporator section, the first and second channels communicating with each other in the condenser and in the evaporator sections of the first channel; d. at least one coolant channel integrated within the envelope and adapted to transfer, by means of an internal flowing coolant, heat away from one or both of the first and second channels.