Heat Pipe Cooling Bracket for Access Point Thermal Management
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Solution Overview
Problem
High heat density in computer systems, particularly in access point devices with many electronic components in a small space, poses challenges for cooling, as conventional methods like convection may be insufficient, and targeted cooling of specific high-heat generation components is needed to maintain performance and extend the system's life.
Innovation Solution
A geometrically adapted heat pipe integrated with a mounting bracket and heat exchanger fins is used to directly couple with high-heat generation components, employing conduction and convection to efficiently remove heat from targeted components, such as processors, within the access point device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cooling methods (convection) are used, then the system can operate with simple cooling structures, but heat removal efficiency is insufficient for high-density electronic components
Solution Approach 1:
The patent employs heat pipes that utilize phase transition (evaporation and condensation) of working fluid to transfer heat efficiently from high-heat generation components. The heat pipe contains a working fluid that evaporates at the heat intake section near the heat source and condenses at the heat outlet section, providing high heat removal efficiency without requiring complex active cooling systems
Solution Approach 2:
The cooling apparatus is integrated with the mounting bracket, combining the structural support function with the heat dissipation function. The heat pipe is coupled to the mounting bracket, which serves both to mount the electronic device and to conduct heat away, eliminating the need for separate cooling structures
2Productivity
If targeted cooling of specific components is implemented, then heat removal efficiency improves, but the device structure becomes more complex
Solution Approach 1:
The heat pipe is positioned to be in direct thermal contact with specific high-heat generation components such as the CPU, providing localized cooling where it is most needed. The heat intake section of the heat pipe is specifically coupled to the heat-generating component, while the heat outlet section is positioned for effective heat dissipation, creating a targeted cooling solution without requiring complex multi-zone cooling systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves heat removal efficiency by 28% compared to traditional methods, reducing the system's temperature and extending its operational life while maintaining performance, especially in high-heat generation components like CPUs.
Implementation Method 1
a heat pipe to be directly coupled with a targeted electronic component... removing heat from the electronic component at a heat intake section of the heat pipe
Implementation Method 2
employing conduction and convection to efficiently remove heat from targeted components
Implementation Method 3
employing conduction and convection to efficiently remove heat from targeted components... heat exchanger fins
Data Source
AI summary
A cooling apparatus is disclosed for cooling an electronic device, the apparatus including a conductive mounting bracket to couple with an electronic device housing and a heat sink integrated with the conductive mounting bracket. The cooling apparatus further includes a heat pipe coupled with the conductive mounting bracket on a first side of the heat pipe, the heat pipe to be directly coupled with a targeted electronic component within the electronic device, on a second side of the heat pipe. The apparatus may further include a conductive mounting interface attached to the electronic device housing to attach to the conductive mounting bracket. A mounting receptacle deployed within the conductive mounting interface may be used to expose the targeted electronic component.