Heat Pipe Cooling Device for High Voltage Electrical Components
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Solution Overview
Problem
High-voltage electrical components face thermal limitations due to high thermal contact resistance between the electrical component and the heat pipe container, leading to inefficient heat dissipation and temperature regulation in high-voltage systems.
Innovation Solution
A heat pipe cooling device with a container composed of two materially connected parts, where the first part has a surface section of the electrical component and the second part carries a hollow connection fitting for an insulating tube, reducing thermal contact resistance by direct contact of the working fluid with the surface section and using a bonded joint with hardenable adhesive for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional heat pipe container is used with separate mounting of the electrical component, then the structure is simpler to manufacture, but the thermal contact resistance between the electrical component and the heat pipe container is high, reducing heat dissipation efficiency
Solution Approach 1:
The electrical component is integrated directly into the container wall structure, eliminating the separate mounting interface. The container wall itself serves as both the structural boundary and the thermal conduction path, merging two previously separate functions into one unified structure.
Solution Approach 2:
The container wall is designed to perform multiple functions simultaneously: it provides the structural boundary of the heat pipe, serves as the mounting substrate for the electrical component, and acts as the thermal conduction path. This multi-functionality eliminates the need for separate mounting structures and reduces thermal contact resistance.
2Productivity
If the electrical component is integrated into the container wall, then thermal contact resistance is reduced and heat dissipation efficiency is improved, but the manufacturing process becomes more complex requiring precision grooves and bonded joints
Solution Approach 1:
The groove for receiving the electrical component is pre-formed into the container wall during the container manufacturing process, before the heat pipe assembly is finalized. This preliminary structuring ensures proper thermal contact and mechanical integration without requiring complex post-assembly operations.
Solution Approach 2:
A bonded joint material is introduced as an intermediary between the container wall and the electrical component, filling the groove and creating a strong thermal and mechanical connection. This intermediary material compensates for surface irregularities and ensures optimal thermal contact.
3Strength
If a bonded joint with hardenable adhesive is used to connect container parts, then thermal conductivity and joint strength are enhanced, but the manufacturing process requires additional steps for adhesive application and curing
Solution Approach 1:
The adhesive material undergoes a parameter change from liquid to solid state through hardening or curing. This phase transition allows the adhesive to initially fill gaps and accommodate tolerances, then transform into a strong, rigid bond that provides both mechanical strength and thermal conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces thermal resistance, increasing the efficiency of heat dissipation and maintaining the electrical component at a lower temperature, while also simplifying manufacturing and ensuring long-term stability and cost-effectiveness.
Implementation Method 1
heat loss occurring in the electrical component is now transferred within the container from the surface section of the electrical component to the working fluid
Implementation Method 2
the working medium is vaporized by absorbing heat loss in the container. The steam travels by natural convection from the container to the cooling surface, where the steam condenses
Implementation Method 3
The steam travels by natural convection from the container to the cooling surface
Implementation Method 4
a bonded joint with hardenable adhesive for enhanced thermal conductivity
Data Source
Figure 1~4
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Figure 8~9
AI summary
The cooling device has a container (B) with two cohesively interconnected container sections, where one container section has a surface section of an electrical component of a high voltage assembly (A). Another container section bears a hollow connection fitting for an insulating tube (I). The cohesive connections are executed as adhesive connections. An independent claim is also included for a method for manufacturing a cooling device.