Heat Pipe Thermoelectric Cooling to Minimize Chamber Heat Leakage
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Solution Overview
Problem
Conventional thermoelectric cooling systems are inefficient for cold storage due to high power consumption when maintaining a chamber at a low temperature, as they need to be switched on for long intervals to prevent heat from flowing back into the chamber.
Innovation Solution
The integration of heat pipes with a thermal diode functionality, connected to thermoelectric devices through a metal standoff and Thermal Interface Material, which acts as an insulator when the system is switched off to prevent heat conduction from the ambient back into the chamber, and dissipates heat efficiently when on.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional thermoelectric cooling systems are used without heat pipes, then the system structure is simple, but power consumption increases due to long operating intervals needed to maintain low temperature
Solution Approach 1:
Heat pipes are introduced as intermediary thermal management components between the thermoelectric devices and the ambient environment. These heat pipes actively conduct heat away from the thermoelectric devices when the system is off, preventing heat backflow into the chamber and reducing the frequency needed to activate the thermoelectric cooling, thereby lowering overall power consumption while adding thermal management sophistication to the system structure
Solution Approach 2:
The heat pipes perform preliminary heat dissipation action continuously or periodically even when the thermoelectric devices are off. By pre-cooling or maintaining thermal conditions through passive heat conduction during off-periods, the system reduces the cumulative operating time required for thermoelectric devices, thus reducing energy consumption over complete cycles
2Productivity
If heat pipes are integrated with thermoelectric devices to control heat flow, then power consumption is reduced, but device complexity increases
Solution Approach 1:
The heat pipes are merged with the thermoelectric device assembly by attaching multiple heat pipes to the hot side of the thermoelectric devices. This integration creates a unified thermal management system where the heat pipes and thermoelectric devices work together as a combined heat rejection subsystem, improving cooling efficiency by enhancing heat dissipation capability while maintaining a relatively compact and integrated device structure
Solution Approach 2:
The heat pipe assembly serves multiple functions: it acts as a heat sink, provides thermal pathways for heat rejection, and functions as a thermal buffer during system off-periods. This multi-functionality allows a single integrated component to address multiple thermal management needs, thereby improving overall cooling efficiency without requiring separate dedicated components for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces power consumption and enhances the efficiency of thermoelectric cooling systems by minimizing heat leakage and maintaining low temperatures within the chamber.
Implementation Method 1
the thermoelectric devices transfer heat from a cold side of the thermoelectric devices to a hot side of the thermoelectric devices
Implementation Method 2
the heat pipes dissipate the heat to the ambient
Implementation Method 3
At least one of the heat pipes comprises a working fluid, an adiabatic section, and a condenser section
Implementation Method 4
When the thermoelectric device is switched off, the heat pipes act as an insulator and prevent conduction of heat from the ambient to the fluid
Implementation Method 5
The condenser section is connected to a heat sink that has fins to assist dissipation of heat
Data Source
AI summary
In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.