Heat Pipe Base Coplanar Finishing for Better Thermal Contact
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Solution Overview
Problem
The uneven contact surfaces of heat pipes and bases with heat sinks hinder the improvement of heat dissipation efficiency in electronic products due to closer component arrangements, necessitating enhanced thermal contact for better heat conduction.
Innovation Solution
A manufacturing method involving mechanical processing to flatten and coplanarize the surfaces of heat pipes and thermally-conductive bases, ensuring a distance of less than 0.05 mm between these surfaces, thereby improving overall flatness and enhancing heat conduction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If heat pipes are disposed on a base that is in thermal contact with a heat sink, then the heat pipe may be in thermal contact with the heat sink along with the base for increasing the heat conduction efficiency, but the surfaces of the heat pipes and the base that are in contact with the heat sink are uneven, making the heat dissipation efficiency difficult to be improved
Solution Approach 1:
The patent applies preliminary action by performing mechanical processing (squeezing and abrasion) on the heat pipes and base before final assembly with the heat sink. The squeezing process pre-flattens the contact surfaces, and the abrasion process pre-coarsens them to ensure proper fit and thermal contact, eliminating the need for post-assembly adjustments and ensuring optimal heat dissipation performance.
2Productivity
If electronic components are arranged closer to achieve high speed and small size, then the electronic product becomes more powerful and thinner, but the heat dissipation efficiency becomes a crucial limiting factor
Solution Approach 1:
The patent merges the heat pipes with the base by disposing them directly on the base in thermal contact configuration. This integration creates a unified heat dissipation structure where the heat pipes and base work together as a single thermal management system, improving heat dissipation efficiency while avoiding the need for separate, complex mounting arrangements.
3Manufacturing precision
If the first surface of the heat pipe and the heat dissipation surface of the base are made substantially coplanar and directly connected, then the distance between them can be smaller than 0.05 mm, but this requires performing both first mechanical processing procedure to squeeze the heat pipe and second mechanical processing procedure to abrade the surfaces
Solution Approach 1:
The patent applies continuity of useful action by implementing a continuous mechanical processing sequence where the squeezing process is followed immediately by the abrasion process. This continuous workflow ensures that the heat pipe surfaces are first flattened by squeezing and then progressively coarsened by abrasion without interruption, maintaining optimal surface geometry and thermal contact properties throughout the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method increases heat conduction efficiency among the thermally-conductive base, heat pipes, and heat exchangers, leading to improved heat dissipation efficiency of the heat dissipation device.
Implementation Method 1
performing a first mechanical processing procedure to squeeze the at least one heat pipe so as to flatten a first surface of the at least one heat pipe
Implementation Method 2
performing a second mechanical processing procedure to abrade the heat dissipation surface of the thermally-conductive base and the first surface of the at least one heat pipe
Implementation Method 3
the heat pipe may be in thermal contact with the heat sink along with the base for increasing the heat conduction efficiency
Data Source
AI summary
A heat dissipation device includes a thermally-conductive base and at least one heat pipe. The thermally-conductive base has a heat absorbing surface, a heat dissipation surface and at least one accommodation hole. The heat dissipation surface faces away from the heat absorbing surface, and the at least one accommodation hole extends from the heat absorbing surface to the heat dissipation surface. The at least one heat pipe is located in the at least one accommodation hole and has a first surface and a second surface which are exposed to outside. The second surface faces away from the first surface, and the first surface and the heat dissipation surface are substantially coplanar and directly connected to each other so as to form a same plane together.